JPWO2024219076A5 - - Google Patents

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Publication number
JPWO2024219076A5
JPWO2024219076A5 JP2025515069A JP2025515069A JPWO2024219076A5 JP WO2024219076 A5 JPWO2024219076 A5 JP WO2024219076A5 JP 2025515069 A JP2025515069 A JP 2025515069A JP 2025515069 A JP2025515069 A JP 2025515069A JP WO2024219076 A5 JPWO2024219076 A5 JP WO2024219076A5
Authority
JP
Japan
Prior art keywords
substrate processing
optical sensor
inclined surface
distance
lens structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025515069A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024219076A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/005811 external-priority patent/WO2024219076A1/ja
Publication of JPWO2024219076A1 publication Critical patent/JPWO2024219076A1/ja
Publication of JPWO2024219076A5 publication Critical patent/JPWO2024219076A5/ja
Pending legal-status Critical Current

Links

JP2025515069A 2023-04-21 2024-02-19 Pending JPWO2024219076A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023070199 2023-04-21
PCT/JP2024/005811 WO2024219076A1 (ja) 2023-04-21 2024-02-19 基板処理システム

Publications (2)

Publication Number Publication Date
JPWO2024219076A1 JPWO2024219076A1 (https=) 2024-10-24
JPWO2024219076A5 true JPWO2024219076A5 (https=) 2026-01-26

Family

ID=93152630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025515069A Pending JPWO2024219076A1 (https=) 2023-04-21 2024-02-19

Country Status (6)

Country Link
US (1) US20260040872A1 (https=)
JP (1) JPWO2024219076A1 (https=)
KR (1) KR20260002899A (https=)
CN (1) CN121079765A (https=)
TW (1) TW202447835A (https=)
WO (1) WO2024219076A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226014A (ja) * 2009-03-25 2010-10-07 Panasonic Corp 基板搬送装置
US10014198B2 (en) 2015-08-21 2018-07-03 Lam Research Corporation Wear detection of consumable part in semiconductor manufacturing equipment
US10269545B2 (en) * 2016-08-03 2019-04-23 Lam Research Corporation Methods for monitoring plasma processing systems for advanced process and tool control
US12215966B2 (en) * 2019-12-06 2025-02-04 Applied Materials, Inc. Methods and systems of optical inspection of electronic device manufacturing machines
JP7507639B2 (ja) * 2020-09-02 2024-06-28 東京エレクトロン株式会社 基板処理システム及び状態監視方法
JP7816869B2 (ja) 2021-02-26 2026-02-18 東京エレクトロン株式会社 搬送システム、搬送装置及び搬送方法
JP7616941B2 (ja) * 2021-05-11 2025-01-17 東京エレクトロン株式会社 基板処理システム及び環状部材の高さ推定方法

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