JPWO2024210048A1 - - Google Patents
Info
- Publication number
- JPWO2024210048A1 JPWO2024210048A1 JP2025512532A JP2025512532A JPWO2024210048A1 JP WO2024210048 A1 JPWO2024210048 A1 JP WO2024210048A1 JP 2025512532 A JP2025512532 A JP 2025512532A JP 2025512532 A JP2025512532 A JP 2025512532A JP WO2024210048 A1 JPWO2024210048 A1 JP WO2024210048A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023062771 | 2023-04-07 | ||
| PCT/JP2024/012955 WO2024210048A1 (ja) | 2023-04-07 | 2024-03-29 | 基板処理方法および基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024210048A1 true JPWO2024210048A1 (https=) | 2024-10-10 |
| JPWO2024210048A5 JPWO2024210048A5 (https=) | 2025-12-15 |
Family
ID=92971712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025512532A Pending JPWO2024210048A1 (https=) | 2023-04-07 | 2024-03-29 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024210048A1 (https=) |
| KR (1) | KR20250174051A (https=) |
| CN (1) | CN120981892A (https=) |
| TW (1) | TW202442353A (https=) |
| WO (1) | WO2024210048A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4986664A (en) * | 1984-02-07 | 1991-01-22 | International Technical Associates | System and process for controlled removal of material to produce a desired surface contour |
| US5953578A (en) * | 1998-09-08 | 1999-09-14 | Winbond Electronics Corp. | Global planarization method using plasma etching |
| JP3943869B2 (ja) | 2000-06-29 | 2007-07-11 | 信越半導体株式会社 | 半導体ウエーハの加工方法および半導体ウエーハ |
| JP6849382B2 (ja) * | 2016-10-17 | 2021-03-24 | 矢崎総業株式会社 | レーザ加工方法及びレーザ加工装置 |
| US20220184743A1 (en) * | 2019-04-05 | 2022-06-16 | Tokyo Electron Limited | Substrate processing system and substrate processing method |
| WO2022054611A1 (ja) * | 2020-09-09 | 2022-03-17 | 東京エレクトロン株式会社 | レーザー加工装置、及びレーザー加工方法 |
| TWI903014B (zh) * | 2021-01-21 | 2025-11-01 | 日商東京威力科創股份有限公司 | 基板加工方法及基板加工裝置 |
| JP7596191B2 (ja) * | 2021-03-24 | 2024-12-09 | 株式会社東京精密 | シリコンウエハの表面改質方法 |
| JP7798582B2 (ja) * | 2022-01-18 | 2026-01-14 | 株式会社東京精密 | 半導体ウエハ表面の平坦化装置 |
-
2024
- 2024-03-28 TW TW113111572A patent/TW202442353A/zh unknown
- 2024-03-29 JP JP2025512532A patent/JPWO2024210048A1/ja active Pending
- 2024-03-29 CN CN202480021449.8A patent/CN120981892A/zh active Pending
- 2024-03-29 KR KR1020257037012A patent/KR20250174051A/ko active Pending
- 2024-03-29 WO PCT/JP2024/012955 patent/WO2024210048A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW202442353A (zh) | 2024-11-01 |
| WO2024210048A1 (ja) | 2024-10-10 |
| CN120981892A (zh) | 2025-11-18 |
| KR20250174051A (ko) | 2025-12-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250924 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250924 |