JPWO2024195468A1 - - Google Patents
Info
- Publication number
- JPWO2024195468A1 JPWO2024195468A1 JP2025508267A JP2025508267A JPWO2024195468A1 JP WO2024195468 A1 JPWO2024195468 A1 JP WO2024195468A1 JP 2025508267 A JP2025508267 A JP 2025508267A JP 2025508267 A JP2025508267 A JP 2025508267A JP WO2024195468 A1 JPWO2024195468 A1 JP WO2024195468A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023044198 | 2023-03-20 | ||
| PCT/JP2024/007527 WO2024195468A1 (ja) | 2023-03-20 | 2024-02-29 | 電子部品および電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024195468A1 true JPWO2024195468A1 (https=) | 2024-09-26 |
| JPWO2024195468A5 JPWO2024195468A5 (https=) | 2025-12-09 |
Family
ID=92841906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025508267A Pending JPWO2024195468A1 (https=) | 2023-03-20 | 2024-02-29 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024195468A1 (https=) |
| WO (1) | WO2024195468A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS616892A (ja) * | 1984-06-20 | 1986-01-13 | キヤノン株式会社 | プリント回路の製造方法 |
| GB0402960D0 (en) * | 2004-02-10 | 2004-03-17 | Plastic Logic Ltd | Thermal imaging of catalyst in electroless deposition of metal films |
| JP5826532B2 (ja) * | 2010-07-15 | 2015-12-02 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| JP2017028079A (ja) * | 2015-07-22 | 2017-02-02 | イビデン株式会社 | プリント配線板の製造方法およびプリント配線板 |
| JP2018037637A (ja) * | 2016-08-31 | 2018-03-08 | 株式会社東芝 | 半導体装置、及び半導体装置の製造方法 |
| JP6745560B1 (ja) * | 2020-03-25 | 2020-08-26 | 株式会社イオックス | パターン形状の無電解めっき層を有するめっき物 |
| JP7718491B2 (ja) * | 2021-08-24 | 2025-08-05 | 株式会社レゾナック | 電子部品装置を製造する方法、及び電子部品装置 |
-
2024
- 2024-02-29 JP JP2025508267A patent/JPWO2024195468A1/ja active Pending
- 2024-02-29 WO PCT/JP2024/007527 patent/WO2024195468A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024195468A1 (ja) | 2024-09-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250916 |