JPWO2024176947A1 - - Google Patents
Info
- Publication number
- JPWO2024176947A1 JPWO2024176947A1 JP2025502319A JP2025502319A JPWO2024176947A1 JP WO2024176947 A1 JPWO2024176947 A1 JP WO2024176947A1 JP 2025502319 A JP2025502319 A JP 2025502319A JP 2025502319 A JP2025502319 A JP 2025502319A JP WO2024176947 A1 JPWO2024176947 A1 JP WO2024176947A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023025785 | 2023-02-22 | ||
| JP2023025785 | 2023-02-22 | ||
| PCT/JP2024/005317 WO2024176947A1 (ja) | 2023-02-22 | 2024-02-15 | 半導体装置、電力変換装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024176947A1 true JPWO2024176947A1 (https=) | 2024-08-29 |
| JPWO2024176947A5 JPWO2024176947A5 (https=) | 2025-04-30 |
| JP7834232B2 JP7834232B2 (ja) | 2026-03-23 |
Family
ID=92501105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025502319A Active JP7834232B2 (ja) | 2023-02-22 | 2024-02-15 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7834232B2 (https=) |
| WO (1) | WO2024176947A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169694A (ja) * | 1983-03-16 | 1984-09-25 | Hitachi Ltd | 半田接着方法 |
| JPH0596395A (ja) * | 1991-10-04 | 1993-04-20 | Mitsubishi Electric Corp | 接合材、接合方法および半導体装置 |
| JP2006339174A (ja) * | 2005-05-31 | 2006-12-14 | Hitachi Ltd | 半導体装置 |
| JP2014050871A (ja) * | 2012-09-10 | 2014-03-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
| WO2016190205A1 (ja) * | 2015-05-26 | 2016-12-01 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法、及び接合材料 |
| JP2019204828A (ja) * | 2018-05-22 | 2019-11-28 | 三菱電機株式会社 | 半導体装置、電力変換装置、および半導体装置の製造方法 |
-
2024
- 2024-02-15 JP JP2025502319A patent/JP7834232B2/ja active Active
- 2024-02-15 WO PCT/JP2024/005317 patent/WO2024176947A1/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169694A (ja) * | 1983-03-16 | 1984-09-25 | Hitachi Ltd | 半田接着方法 |
| JPH0596395A (ja) * | 1991-10-04 | 1993-04-20 | Mitsubishi Electric Corp | 接合材、接合方法および半導体装置 |
| JP2006339174A (ja) * | 2005-05-31 | 2006-12-14 | Hitachi Ltd | 半導体装置 |
| JP2014050871A (ja) * | 2012-09-10 | 2014-03-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
| WO2016190205A1 (ja) * | 2015-05-26 | 2016-12-01 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法、及び接合材料 |
| JP2019204828A (ja) * | 2018-05-22 | 2019-11-28 | 三菱電機株式会社 | 半導体装置、電力変換装置、および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7834232B2 (ja) | 2026-03-23 |
| WO2024176947A1 (ja) | 2024-08-29 |
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