JPWO2024143385A5 - - Google Patents

Info

Publication number
JPWO2024143385A5
JPWO2024143385A5 JP2024567876A JP2024567876A JPWO2024143385A5 JP WO2024143385 A5 JPWO2024143385 A5 JP WO2024143385A5 JP 2024567876 A JP2024567876 A JP 2024567876A JP 2024567876 A JP2024567876 A JP 2024567876A JP WO2024143385 A5 JPWO2024143385 A5 JP WO2024143385A5
Authority
JP
Japan
Prior art keywords
region
sic
semiconductor device
sic semiconductor
extension direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024567876A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024143385A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/046706 external-priority patent/WO2024143385A1/ja
Publication of JPWO2024143385A1 publication Critical patent/JPWO2024143385A1/ja
Publication of JPWO2024143385A5 publication Critical patent/JPWO2024143385A5/ja
Pending legal-status Critical Current

Links

JP2024567876A 2022-12-28 2023-12-26 Pending JPWO2024143385A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022212609 2022-12-28
PCT/JP2023/046706 WO2024143385A1 (ja) 2022-12-28 2023-12-26 ＳｉＣ半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024143385A1 JPWO2024143385A1 (cg-RX-API-DMAC7.html) 2024-07-04
JPWO2024143385A5 true JPWO2024143385A5 (cg-RX-API-DMAC7.html) 2025-09-11

Family

ID=91718130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024567876A Pending JPWO2024143385A1 (cg-RX-API-DMAC7.html) 2022-12-28 2023-12-26

Country Status (5)

Country Link
US (1) US20250318214A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024143385A1 (cg-RX-API-DMAC7.html)
CN (1) CN120419308A (cg-RX-API-DMAC7.html)
DE (1) DE112023004912T5 (cg-RX-API-DMAC7.html)
WO (1) WO2024143385A1 (cg-RX-API-DMAC7.html)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6287469B2 (ja) * 2014-03-28 2018-03-07 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
JP5757355B2 (ja) * 2014-04-23 2015-07-29 富士電機株式会社 超接合半導体装置の製造方法
JP7081087B2 (ja) * 2017-06-02 2022-06-07 富士電機株式会社 絶縁ゲート型半導体装置及びその製造方法
JP7140642B2 (ja) * 2018-11-15 2022-09-21 トヨタ自動車株式会社 スイッチング素子
JP7293750B2 (ja) * 2019-03-14 2023-06-20 富士電機株式会社 超接合炭化珪素半導体装置および超接合炭化珪素半導体装置の製造方法
JP2022090527A (ja) * 2020-12-07 2022-06-17 株式会社デンソー 電界効果トランジスタの製造方法
DE112021006727T5 (de) * 2021-02-01 2023-10-12 Rohm Co., Ltd. Sic-halbleiterbauelement

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