JPWO2024127586A1 - - Google Patents

Info

Publication number
JPWO2024127586A1
JPWO2024127586A1 JP2024564068A JP2024564068A JPWO2024127586A1 JP WO2024127586 A1 JPWO2024127586 A1 JP WO2024127586A1 JP 2024564068 A JP2024564068 A JP 2024564068A JP 2024564068 A JP2024564068 A JP 2024564068A JP WO2024127586 A1 JPWO2024127586 A1 JP WO2024127586A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024564068A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024127586A1 publication Critical patent/JPWO2024127586A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222Image processing arrangements associated with the tube
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26Electron or ion microscopes
    • H01J2237/28Scanning microscopes
    • H01J2237/2803Scanning microscopes characterised by the imaging method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2024564068A 2022-12-15 2022-12-15 Pending JPWO2024127586A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/046201 WO2024127586A1 (ja) 2022-12-15 2022-12-15 荷電粒子線装置及び試料の特性を推定する方法

Publications (1)

Publication Number Publication Date
JPWO2024127586A1 true JPWO2024127586A1 (https=) 2024-06-20

Family

ID=91484646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024564068A Pending JPWO2024127586A1 (https=) 2022-12-15 2022-12-15

Country Status (4)

Country Link
JP (1) JPWO2024127586A1 (https=)
KR (1) KR20250090315A (https=)
TW (1) TWI854868B (https=)
WO (1) WO2024127586A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208579A (ja) * 1999-01-08 2000-07-28 Schlumberger Technol Inc 微小構造欠陥の検出
JP2000314710A (ja) * 1999-04-28 2000-11-14 Hitachi Ltd 回路パターンの検査方法及び検査装置
US20040161866A1 (en) * 2003-01-15 2004-08-19 Kang Hyo-Cheon Method for inspecting a wafer and apparatus for inspecting a wafer
JP2004266069A (ja) * 2003-02-28 2004-09-24 Sharp Corp 半導体集積回路の不良箇所特定用試料の作成方法及び不良箇所特定方法
JP2005164451A (ja) * 2003-12-04 2005-06-23 Hitachi Ltd 荷電粒子ビームによる検査方法および検査装置
JP2006338881A (ja) * 2005-05-31 2006-12-14 Hitachi High-Technologies Corp 電子顕微鏡応用装置および試料検査方法
JP2008252085A (ja) * 2008-03-06 2008-10-16 Hitachi Ltd 荷電粒子線を用いた基板検査装置および基板検査方法
JP2009092673A (ja) * 2008-12-26 2009-04-30 Hitachi Ltd レビューsem
US20180284184A1 (en) * 2017-03-30 2018-10-04 Globalfoundries Inc. Apparatus for and method of net trace prior level subtraction
JP2021027212A (ja) * 2019-08-07 2021-02-22 株式会社日立ハイテク 電気特性を導出するシステム及び非一時的コンピューター可読媒体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7305422B2 (ja) * 2019-05-13 2023-07-10 株式会社日立ハイテク パターン評価システム及びパターン評価方法
JP7493047B2 (ja) 2020-09-18 2024-05-30 株式会社日立ハイテク 検査システム

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208579A (ja) * 1999-01-08 2000-07-28 Schlumberger Technol Inc 微小構造欠陥の検出
JP2000314710A (ja) * 1999-04-28 2000-11-14 Hitachi Ltd 回路パターンの検査方法及び検査装置
US20040161866A1 (en) * 2003-01-15 2004-08-19 Kang Hyo-Cheon Method for inspecting a wafer and apparatus for inspecting a wafer
JP2004266069A (ja) * 2003-02-28 2004-09-24 Sharp Corp 半導体集積回路の不良箇所特定用試料の作成方法及び不良箇所特定方法
JP2005164451A (ja) * 2003-12-04 2005-06-23 Hitachi Ltd 荷電粒子ビームによる検査方法および検査装置
JP2006338881A (ja) * 2005-05-31 2006-12-14 Hitachi High-Technologies Corp 電子顕微鏡応用装置および試料検査方法
JP2008252085A (ja) * 2008-03-06 2008-10-16 Hitachi Ltd 荷電粒子線を用いた基板検査装置および基板検査方法
JP2009092673A (ja) * 2008-12-26 2009-04-30 Hitachi Ltd レビューsem
US20180284184A1 (en) * 2017-03-30 2018-10-04 Globalfoundries Inc. Apparatus for and method of net trace prior level subtraction
JP2021027212A (ja) * 2019-08-07 2021-02-22 株式会社日立ハイテク 電気特性を導出するシステム及び非一時的コンピューター可読媒体

Also Published As

Publication number Publication date
WO2024127586A1 (ja) 2024-06-20
TW202427531A (zh) 2024-07-01
KR20250090315A (ko) 2025-06-19
TWI854868B (zh) 2024-09-01

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