JPWO2024127586A1 - - Google Patents
Info
- Publication number
- JPWO2024127586A1 JPWO2024127586A1 JP2024564068A JP2024564068A JPWO2024127586A1 JP WO2024127586 A1 JPWO2024127586 A1 JP WO2024127586A1 JP 2024564068 A JP2024564068 A JP 2024564068A JP 2024564068 A JP2024564068 A JP 2024564068A JP WO2024127586 A1 JPWO2024127586 A1 JP WO2024127586A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2803—Scanning microscopes characterised by the imaging method
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/046201 WO2024127586A1 (ja) | 2022-12-15 | 2022-12-15 | 荷電粒子線装置及び試料の特性を推定する方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024127586A1 true JPWO2024127586A1 (https=) | 2024-06-20 |
Family
ID=91484646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564068A Pending JPWO2024127586A1 (https=) | 2022-12-15 | 2022-12-15 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024127586A1 (https=) |
| KR (1) | KR20250090315A (https=) |
| TW (1) | TWI854868B (https=) |
| WO (1) | WO2024127586A1 (https=) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000208579A (ja) * | 1999-01-08 | 2000-07-28 | Schlumberger Technol Inc | 微小構造欠陥の検出 |
| JP2000314710A (ja) * | 1999-04-28 | 2000-11-14 | Hitachi Ltd | 回路パターンの検査方法及び検査装置 |
| US20040161866A1 (en) * | 2003-01-15 | 2004-08-19 | Kang Hyo-Cheon | Method for inspecting a wafer and apparatus for inspecting a wafer |
| JP2004266069A (ja) * | 2003-02-28 | 2004-09-24 | Sharp Corp | 半導体集積回路の不良箇所特定用試料の作成方法及び不良箇所特定方法 |
| JP2005164451A (ja) * | 2003-12-04 | 2005-06-23 | Hitachi Ltd | 荷電粒子ビームによる検査方法および検査装置 |
| JP2006338881A (ja) * | 2005-05-31 | 2006-12-14 | Hitachi High-Technologies Corp | 電子顕微鏡応用装置および試料検査方法 |
| JP2008252085A (ja) * | 2008-03-06 | 2008-10-16 | Hitachi Ltd | 荷電粒子線を用いた基板検査装置および基板検査方法 |
| JP2009092673A (ja) * | 2008-12-26 | 2009-04-30 | Hitachi Ltd | レビューsem |
| US20180284184A1 (en) * | 2017-03-30 | 2018-10-04 | Globalfoundries Inc. | Apparatus for and method of net trace prior level subtraction |
| JP2021027212A (ja) * | 2019-08-07 | 2021-02-22 | 株式会社日立ハイテク | 電気特性を導出するシステム及び非一時的コンピューター可読媒体 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7305422B2 (ja) * | 2019-05-13 | 2023-07-10 | 株式会社日立ハイテク | パターン評価システム及びパターン評価方法 |
| JP7493047B2 (ja) | 2020-09-18 | 2024-05-30 | 株式会社日立ハイテク | 検査システム |
-
2022
- 2022-12-15 JP JP2024564068A patent/JPWO2024127586A1/ja active Pending
- 2022-12-15 WO PCT/JP2022/046201 patent/WO2024127586A1/ja not_active Ceased
- 2022-12-15 KR KR1020257015794A patent/KR20250090315A/ko active Pending
-
2023
- 2023-10-26 TW TW112140991A patent/TWI854868B/zh active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000208579A (ja) * | 1999-01-08 | 2000-07-28 | Schlumberger Technol Inc | 微小構造欠陥の検出 |
| JP2000314710A (ja) * | 1999-04-28 | 2000-11-14 | Hitachi Ltd | 回路パターンの検査方法及び検査装置 |
| US20040161866A1 (en) * | 2003-01-15 | 2004-08-19 | Kang Hyo-Cheon | Method for inspecting a wafer and apparatus for inspecting a wafer |
| JP2004266069A (ja) * | 2003-02-28 | 2004-09-24 | Sharp Corp | 半導体集積回路の不良箇所特定用試料の作成方法及び不良箇所特定方法 |
| JP2005164451A (ja) * | 2003-12-04 | 2005-06-23 | Hitachi Ltd | 荷電粒子ビームによる検査方法および検査装置 |
| JP2006338881A (ja) * | 2005-05-31 | 2006-12-14 | Hitachi High-Technologies Corp | 電子顕微鏡応用装置および試料検査方法 |
| JP2008252085A (ja) * | 2008-03-06 | 2008-10-16 | Hitachi Ltd | 荷電粒子線を用いた基板検査装置および基板検査方法 |
| JP2009092673A (ja) * | 2008-12-26 | 2009-04-30 | Hitachi Ltd | レビューsem |
| US20180284184A1 (en) * | 2017-03-30 | 2018-10-04 | Globalfoundries Inc. | Apparatus for and method of net trace prior level subtraction |
| JP2021027212A (ja) * | 2019-08-07 | 2021-02-22 | 株式会社日立ハイテク | 電気特性を導出するシステム及び非一時的コンピューター可読媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024127586A1 (ja) | 2024-06-20 |
| TW202427531A (zh) | 2024-07-01 |
| KR20250090315A (ko) | 2025-06-19 |
| TWI854868B (zh) | 2024-09-01 |
Similar Documents
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| Date | Code | Title | Description |
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