JPWO2024122495A1 - - Google Patents
Info
- Publication number
- JPWO2024122495A1 JPWO2024122495A1 JP2024562760A JP2024562760A JPWO2024122495A1 JP WO2024122495 A1 JPWO2024122495 A1 JP WO2024122495A1 JP 2024562760 A JP2024562760 A JP 2024562760A JP 2024562760 A JP2024562760 A JP 2024562760A JP WO2024122495 A1 JPWO2024122495 A1 JP WO2024122495A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022194283 | 2022-12-05 | ||
| JP2022194283 | 2022-12-05 | ||
| PCT/JP2023/043286 WO2024122495A1 (ja) | 2022-12-05 | 2023-12-04 | 半導体素子の製造方法および製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024122495A1 true JPWO2024122495A1 (https=) | 2024-06-13 |
| JPWO2024122495A5 JPWO2024122495A5 (https=) | 2025-08-12 |
| JP7854514B2 JP7854514B2 (ja) | 2026-05-01 |
Family
ID=91379242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024562760A Active JP7854514B2 (ja) | 2022-12-05 | 2023-12-04 | 半導体素子の製造方法および製造装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7854514B2 (https=) |
| WO (1) | WO2024122495A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019134101A (ja) * | 2018-01-31 | 2019-08-08 | 京セラ株式会社 | 半導体素子の製造方法 |
| WO2020175684A1 (ja) * | 2019-02-28 | 2020-09-03 | 京セラ株式会社 | 半導体素子の製造方法および半導体素子体 |
| JP2021503713A (ja) * | 2017-11-20 | 2021-02-12 | 廈門市三安光電科技有限公司 | マイクロデバイスのマストランスファー方法 |
| JP2021145052A (ja) * | 2020-03-12 | 2021-09-24 | 京セラ株式会社 | 半導体素子の製造方法 |
| JP2022523861A (ja) * | 2019-03-12 | 2022-04-26 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 支持板を使用して１つ以上の素子のバーを除去するための方法 |
-
2023
- 2023-12-04 JP JP2024562760A patent/JP7854514B2/ja active Active
- 2023-12-04 WO PCT/JP2023/043286 patent/WO2024122495A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021503713A (ja) * | 2017-11-20 | 2021-02-12 | 廈門市三安光電科技有限公司 | マイクロデバイスのマストランスファー方法 |
| JP2019134101A (ja) * | 2018-01-31 | 2019-08-08 | 京セラ株式会社 | 半導体素子の製造方法 |
| WO2020175684A1 (ja) * | 2019-02-28 | 2020-09-03 | 京セラ株式会社 | 半導体素子の製造方法および半導体素子体 |
| JP2022523861A (ja) * | 2019-03-12 | 2022-04-26 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 支持板を使用して１つ以上の素子のバーを除去するための方法 |
| JP2021145052A (ja) * | 2020-03-12 | 2021-09-24 | 京セラ株式会社 | 半導体素子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024122495A1 (ja) | 2024-06-13 |
| JP7854514B2 (ja) | 2026-05-01 |
Similar Documents
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