JPWO2024100934A5 - - Google Patents
Info
- Publication number
- JPWO2024100934A5 JPWO2024100934A5 JP2024557025A JP2024557025A JPWO2024100934A5 JP WO2024100934 A5 JPWO2024100934 A5 JP WO2024100934A5 JP 2024557025 A JP2024557025 A JP 2024557025A JP 2024557025 A JP2024557025 A JP 2024557025A JP WO2024100934 A5 JPWO2024100934 A5 JP WO2024100934A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- filler
- polished surface
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022180433 | 2022-11-10 | ||
| PCT/JP2023/026781 WO2024100934A1 (ja) | 2022-11-10 | 2023-07-21 | エポキシ樹脂組成物、電子部品実装構造体および電子部品実装構造体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024100934A1 JPWO2024100934A1 (cg-RX-API-DMAC7.html) | 2024-05-16 |
| JPWO2024100934A5 true JPWO2024100934A5 (cg-RX-API-DMAC7.html) | 2025-07-22 |
Family
ID=91032570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024557025A Pending JPWO2024100934A1 (cg-RX-API-DMAC7.html) | 2022-11-10 | 2023-07-21 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024100934A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20250105356A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202419504A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2024100934A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025254026A1 (ja) * | 2024-06-05 | 2025-12-11 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、及び半導体装置 |
| WO2026009780A1 (ja) * | 2024-07-03 | 2026-01-08 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
| WO2026009778A1 (ja) * | 2024-07-03 | 2026-01-08 | ナミックス株式会社 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4176619B2 (ja) * | 2003-07-18 | 2008-11-05 | 信越化学工業株式会社 | フリップチップ実装用サイドフィル材及び半導体装置 |
| US12454612B2 (en) * | 2017-05-31 | 2025-10-28 | Resonac Corporation | Liquid resin composition for compression molding and electronic component apparatus |
| US11608435B2 (en) | 2017-06-09 | 2023-03-21 | Nagase Chemtex Corporation | Epoxy resin composition, electronic component mounting structure, and method for producing the same |
| JP7465093B2 (ja) * | 2017-10-10 | 2024-04-10 | 味の素株式会社 | 硬化体及びその製造方法、樹脂シート及び樹脂組成物 |
| JP7148946B2 (ja) * | 2017-12-21 | 2022-10-06 | ナミックス株式会社 | 樹脂組成物 |
| JP7631828B2 (ja) * | 2021-01-22 | 2025-02-19 | 味の素株式会社 | 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置 |
-
2023
- 2023-07-21 JP JP2024557025A patent/JPWO2024100934A1/ja active Pending
- 2023-07-21 WO PCT/JP2023/026781 patent/WO2024100934A1/ja not_active Ceased
- 2023-07-21 KR KR1020257003213A patent/KR20250105356A/ko active Pending
- 2023-08-04 TW TW112129377A patent/TW202419504A/zh unknown