JPWO2024084954A1 - - Google Patents
Info
- Publication number
- JPWO2024084954A1 JPWO2024084954A1 JP2024551441A JP2024551441A JPWO2024084954A1 JP WO2024084954 A1 JPWO2024084954 A1 JP WO2024084954A1 JP 2024551441 A JP2024551441 A JP 2024551441A JP 2024551441 A JP2024551441 A JP 2024551441A JP WO2024084954 A1 JPWO2024084954 A1 JP WO2024084954A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022166827 | 2022-10-18 | ||
| PCT/JP2023/036019 WO2024084954A1 (ja) | 2022-10-18 | 2023-10-03 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024084954A1 true JPWO2024084954A1 (https=) | 2024-04-25 |
| JPWO2024084954A5 JPWO2024084954A5 (https=) | 2025-06-30 |
Family
ID=90737373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024551441A Pending JPWO2024084954A1 (https=) | 2022-10-18 | 2023-10-03 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024084954A1 (https=) |
| WO (1) | WO2024084954A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012091975A (ja) * | 2010-10-28 | 2012-05-17 | Mitsubishi Materials Corp | セラミックス材と金属材との接合体の製造方法 |
| JP5725060B2 (ja) * | 2013-03-14 | 2015-05-27 | 三菱マテリアル株式会社 | 接合体、パワーモジュール用基板、及びヒートシンク付パワーモジュール用基板 |
| JP6651924B2 (ja) * | 2016-03-17 | 2020-02-19 | 三菱マテリアル株式会社 | 接合体の製造方法、及び、パワーモジュール用基板の製造方法 |
| JP7196799B2 (ja) * | 2019-08-21 | 2022-12-27 | 三菱マテリアル株式会社 | 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
-
2023
- 2023-10-03 JP JP2024551441A patent/JPWO2024084954A1/ja active Pending
- 2023-10-03 WO PCT/JP2023/036019 patent/WO2024084954A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024084954A1 (ja) | 2024-04-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250319 |