JPWO2024070518A5 - - Google Patents

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Publication number
JPWO2024070518A5
JPWO2024070518A5 JP2024549941A JP2024549941A JPWO2024070518A5 JP WO2024070518 A5 JPWO2024070518 A5 JP WO2024070518A5 JP 2024549941 A JP2024549941 A JP 2024549941A JP 2024549941 A JP2024549941 A JP 2024549941A JP WO2024070518 A5 JPWO2024070518 A5 JP WO2024070518A5
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JP
Japan
Prior art keywords
wiring
substrate
board according
base material
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024549941A
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English (en)
Japanese (ja)
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JPWO2024070518A1 (cg-RX-API-DMAC7.html
JP7747227B2 (ja
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Priority claimed from PCT/JP2023/032240 external-priority patent/WO2024070518A1/ja
Publication of JPWO2024070518A1 publication Critical patent/JPWO2024070518A1/ja
Publication of JPWO2024070518A5 publication Critical patent/JPWO2024070518A5/ja
Application granted granted Critical
Publication of JP7747227B2 publication Critical patent/JP7747227B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024549941A 2022-09-30 2023-09-04 配線基板 Active JP7747227B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263411770P 2022-09-30 2022-09-30
US63/411,770 2022-09-30
PCT/JP2023/032240 WO2024070518A1 (ja) 2022-09-30 2023-09-04 配線基板

Publications (3)

Publication Number Publication Date
JPWO2024070518A1 JPWO2024070518A1 (cg-RX-API-DMAC7.html) 2024-04-04
JPWO2024070518A5 true JPWO2024070518A5 (cg-RX-API-DMAC7.html) 2025-05-13
JP7747227B2 JP7747227B2 (ja) 2025-10-01

Family

ID=90477330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549941A Active JP7747227B2 (ja) 2022-09-30 2023-09-04 配線基板

Country Status (3)

Country Link
US (1) US20250227846A1 (cg-RX-API-DMAC7.html)
JP (1) JP7747227B2 (cg-RX-API-DMAC7.html)
WO (1) WO2024070518A1 (cg-RX-API-DMAC7.html)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049423A (ja) * 1998-07-30 2000-02-18 Sony Chem Corp フレキシブル基板
JP3826676B2 (ja) * 1999-07-30 2006-09-27 株式会社デンソー プリント配線板の接続方法および接続構造
JP4590689B2 (ja) * 1999-11-30 2010-12-01 株式会社デンソー プリント配線基板の接続方法及び接続構造
JP3767346B2 (ja) * 2000-08-04 2006-04-19 株式会社デンソー プリント配線基板の接続方法
JP2004247403A (ja) * 2003-02-12 2004-09-02 Denso Wave Inc 半田付け装置、半田付け方法、基板接続装置及び基板接続方法
JP2004311578A (ja) * 2003-04-03 2004-11-04 Fujikura Ltd プリント配線基板の接合方法並びに複合プリント配線基板
JP2005045066A (ja) * 2003-07-23 2005-02-17 Matsushita Electric Ind Co Ltd 電気的接続構造およびその製造方法
JP2015023059A (ja) * 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の接続構造、フレキシブルプリント配線板及びその製造方法
JP6405334B2 (ja) * 2016-04-18 2018-10-17 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法

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