JPWO2024057763A1 - - Google Patents
Info
- Publication number
- JPWO2024057763A1 JPWO2024057763A1 JP2024546768A JP2024546768A JPWO2024057763A1 JP WO2024057763 A1 JPWO2024057763 A1 JP WO2024057763A1 JP 2024546768 A JP2024546768 A JP 2024546768A JP 2024546768 A JP2024546768 A JP 2024546768A JP WO2024057763 A1 JPWO2024057763 A1 JP WO2024057763A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022145941 | 2022-09-14 | ||
| PCT/JP2023/028414 WO2024057763A1 (ja) | 2022-09-14 | 2023-08-03 | Ｉ／ｏ回路、半導体装置、セルライブラリ、半導体装置の回路設計方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024057763A1 true JPWO2024057763A1 (https=) | 2024-03-21 |
| JPWO2024057763A5 JPWO2024057763A5 (https=) | 2025-05-22 |
Family
ID=90274754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024546768A Pending JPWO2024057763A1 (https=) | 2022-09-14 | 2023-08-03 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024057763A1 (https=) |
| WO (1) | WO2024057763A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3141865B2 (ja) * | 1998-12-28 | 2001-03-07 | セイコーエプソン株式会社 | 半導体集積装置 |
| JP3386042B2 (ja) * | 2000-08-02 | 2003-03-10 | 日本電気株式会社 | 半導体装置 |
| JP2009164195A (ja) * | 2007-12-28 | 2009-07-23 | Panasonic Corp | 半導体チップ |
| JP2009206402A (ja) * | 2008-02-29 | 2009-09-10 | Fujitsu Microelectronics Ltd | 半導体装置の設計方法及び半導体装置 |
| JP2010080622A (ja) * | 2008-09-25 | 2010-04-08 | Panasonic Corp | 半導体集積回路 |
| JP2022105405A (ja) * | 2021-01-04 | 2022-07-14 | ローム株式会社 | 保護回路およびこの保護回路を備える半導体集積回路 |
-
2023
- 2023-08-03 JP JP2024546768A patent/JPWO2024057763A1/ja active Pending
- 2023-08-03 WO PCT/JP2023/028414 patent/WO2024057763A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024057763A1 (ja) | 2024-03-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250121 |