JPWO2024053333A1 - - Google Patents
Info
- Publication number
- JPWO2024053333A1 JPWO2024053333A1 JP2024545516A JP2024545516A JPWO2024053333A1 JP WO2024053333 A1 JPWO2024053333 A1 JP WO2024053333A1 JP 2024545516 A JP2024545516 A JP 2024545516A JP 2024545516 A JP2024545516 A JP 2024545516A JP WO2024053333 A1 JPWO2024053333 A1 JP WO2024053333A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
- H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
- H10D80/251—FETs covered by H10D30/00, e.g. power FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022143827 | 2022-09-09 | ||
| PCT/JP2023/029164 WO2024053333A1 (ja) | 2022-09-09 | 2023-08-09 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024053333A1 true JPWO2024053333A1 (https=) | 2024-03-14 |
Family
ID=90191030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024545516A Pending JPWO2024053333A1 (https=) | 2022-09-09 | 2023-08-09 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250246534A1 (https=) |
| JP (1) | JPWO2024053333A1 (https=) |
| WO (1) | WO2024053333A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5655339B2 (ja) * | 2010-03-26 | 2015-01-21 | サンケン電気株式会社 | 半導体装置 |
| JP6827776B2 (ja) * | 2016-11-15 | 2021-02-10 | ローム株式会社 | 半導体デバイス |
| JP7284566B2 (ja) * | 2018-10-29 | 2023-05-31 | ローム株式会社 | 半導体装置 |
| JP7260224B2 (ja) * | 2019-01-18 | 2023-04-18 | ローム株式会社 | 半導体装置 |
| JP7312604B2 (ja) * | 2019-05-13 | 2023-07-21 | ローム株式会社 | 半導体装置 |
| JP2021190505A (ja) * | 2020-05-27 | 2021-12-13 | ローム株式会社 | 半導体装置 |
| US20230245956A1 (en) * | 2020-10-14 | 2023-08-03 | Rohm Co., Ltd. | Semiconductor module |
-
2023
- 2023-08-09 JP JP2024545516A patent/JPWO2024053333A1/ja active Pending
- 2023-08-09 WO PCT/JP2023/029164 patent/WO2024053333A1/ja not_active Ceased
-
2025
- 2025-03-05 US US19/071,162 patent/US20250246534A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024053333A1 (ja) | 2024-03-14 |
| US20250246534A1 (en) | 2025-07-31 |