JPWO2024038657A1 - - Google Patents

Info

Publication number
JPWO2024038657A1
JPWO2024038657A1 JP2024541426A JP2024541426A JPWO2024038657A1 JP WO2024038657 A1 JPWO2024038657 A1 JP WO2024038657A1 JP 2024541426 A JP2024541426 A JP 2024541426A JP 2024541426 A JP2024541426 A JP 2024541426A JP WO2024038657 A1 JPWO2024038657 A1 JP WO2024038657A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024541426A
Other languages
Japanese (ja)
Other versions
JP7794323B2 (ja
JPWO2024038657A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024038657A1 publication Critical patent/JPWO2024038657A1/ja
Publication of JPWO2024038657A5 publication Critical patent/JPWO2024038657A5/ja
Application granted granted Critical
Publication of JP7794323B2 publication Critical patent/JP7794323B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2024541426A 2022-08-18 2023-06-02 積層セラミックコンデンサ Active JP7794323B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022130706 2022-08-18
JP2022130706 2022-08-18
PCT/JP2023/020657 WO2024038657A1 (ja) 2022-08-18 2023-06-02 積層セラミックコンデンサ

Publications (3)

Publication Number Publication Date
JPWO2024038657A1 true JPWO2024038657A1 (https=) 2024-02-22
JPWO2024038657A5 JPWO2024038657A5 (https=) 2025-04-23
JP7794323B2 JP7794323B2 (ja) 2026-01-06

Family

ID=89941779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541426A Active JP7794323B2 (ja) 2022-08-18 2023-06-02 積層セラミックコンデンサ

Country Status (4)

Country Link
US (1) US20240304387A1 (https=)
JP (1) JP7794323B2 (https=)
CN (1) CN119365948A (https=)
WO (1) WO2024038657A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024038658A1 (ja) * 2022-08-18 2024-02-22 株式会社村田製作所 積層セラミックコンデンサ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153430A (ja) * 1995-11-30 1997-06-10 Taiyo Yuden Co Ltd チップ状回路部品とその製造方法
JP2003173926A (ja) * 2001-12-05 2003-06-20 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JP2015046422A (ja) * 2013-08-27 2015-03-12 Tdk株式会社 セラミック電子部品
JP2016134616A (ja) * 2015-01-20 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミック電子部品、その製造方法及び電子部品が実装された回路基板
JP2020061524A (ja) * 2018-10-12 2020-04-16 太陽誘電株式会社 セラミック電子部品、セラミック電子部品の製造方法およびセラミック電子部品実装回路基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4475294B2 (ja) * 2007-05-30 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
JP7358692B2 (ja) * 2018-06-15 2023-10-11 サムソン エレクトロ－メカニックス カンパニーリミテッド． キャパシタ部品及びキャパシタ部品の製造方法
KR102620541B1 (ko) * 2018-08-22 2024-01-03 삼성전기주식회사 커패시터 부품
KR102762881B1 (ko) * 2019-09-02 2025-02-07 삼성전기주식회사 적층 세라믹 전자부품
JP7521507B2 (ja) * 2021-09-16 2024-07-24 株式会社村田製作所 積層セラミックコンデンサ
JP7567757B2 (ja) * 2021-11-16 2024-10-16 株式会社村田製作所 積層セラミックコンデンサ
WO2024038658A1 (ja) * 2022-08-18 2024-02-22 株式会社村田製作所 積層セラミックコンデンサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153430A (ja) * 1995-11-30 1997-06-10 Taiyo Yuden Co Ltd チップ状回路部品とその製造方法
JP2003173926A (ja) * 2001-12-05 2003-06-20 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JP2015046422A (ja) * 2013-08-27 2015-03-12 Tdk株式会社 セラミック電子部品
JP2016134616A (ja) * 2015-01-20 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミック電子部品、その製造方法及び電子部品が実装された回路基板
JP2020061524A (ja) * 2018-10-12 2020-04-16 太陽誘電株式会社 セラミック電子部品、セラミック電子部品の製造方法およびセラミック電子部品実装回路基板

Also Published As

Publication number Publication date
JP7794323B2 (ja) 2026-01-06
WO2024038657A1 (ja) 2024-02-22
CN119365948A (zh) 2025-01-24
US20240304387A1 (en) 2024-09-12

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