JPWO2024029628A5 - - Google Patents

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Publication number
JPWO2024029628A5
JPWO2024029628A5 JP2024539224A JP2024539224A JPWO2024029628A5 JP WO2024029628 A5 JPWO2024029628 A5 JP WO2024029628A5 JP 2024539224 A JP2024539224 A JP 2024539224A JP 2024539224 A JP2024539224 A JP 2024539224A JP WO2024029628 A5 JPWO2024029628 A5 JP WO2024029628A5
Authority
JP
Japan
Prior art keywords
wiring board
opening
view
plan
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024539224A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024029628A1 (enExample
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/028615 external-priority patent/WO2024029628A1/ja
Publication of JPWO2024029628A1 publication Critical patent/JPWO2024029628A1/ja
Publication of JPWO2024029628A5 publication Critical patent/JPWO2024029628A5/ja
Pending legal-status Critical Current

Links

JP2024539224A 2022-08-05 2023-08-04 Pending JPWO2024029628A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022125560 2022-08-05
PCT/JP2023/028615 WO2024029628A1 (ja) 2022-08-05 2023-08-04 配線基板、配線基板を用いた電子部品実装用パッケージおよび電子モジュール

Publications (2)

Publication Number Publication Date
JPWO2024029628A1 JPWO2024029628A1 (enExample) 2024-02-08
JPWO2024029628A5 true JPWO2024029628A5 (enExample) 2025-04-22

Family

ID=89849504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024539224A Pending JPWO2024029628A1 (enExample) 2022-08-05 2023-08-04

Country Status (3)

Country Link
EP (1) EP4568426A1 (enExample)
JP (1) JPWO2024029628A1 (enExample)
WO (1) WO2024029628A1 (enExample)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP3801880B2 (ja) * 2001-06-29 2006-07-26 京セラ株式会社 配線基板およびこれを用いた半導体装置
JP2009158511A (ja) * 2007-12-25 2009-07-16 Sumitomo Metal Electronics Devices Inc 入出力端子及び半導体素子収納用パッケージ
WO2010103722A1 (ja) 2009-03-10 2010-09-16 住友ベークライト株式会社 回路基板
JP6436692B2 (ja) * 2014-09-12 2018-12-12 日本オクラロ株式会社 光モジュール、光送受信モジュール、及びフレキシブル基板
JP6825986B2 (ja) * 2017-05-26 2021-02-03 京セラ株式会社 配線基板、電子部品収納用パッケージおよび電子装置

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