JPWO2024029312A5 - - Google Patents

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Publication number
JPWO2024029312A5
JPWO2024029312A5 JP2024513206A JP2024513206A JPWO2024029312A5 JP WO2024029312 A5 JPWO2024029312 A5 JP WO2024029312A5 JP 2024513206 A JP2024513206 A JP 2024513206A JP 2024513206 A JP2024513206 A JP 2024513206A JP WO2024029312 A5 JPWO2024029312 A5 JP WO2024029312A5
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JP
Japan
Prior art keywords
thermoplastic resin
electromagnetic wave
resin composition
molded body
injection
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JP2024513206A
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English (en)
Japanese (ja)
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JP7727893B2 (ja
JPWO2024029312A1 (https=
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Priority claimed from JP2022124303A external-priority patent/JP7310996B1/ja
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JP2024513206A 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体 Active JP7727893B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022124303A JP7310996B1 (ja) 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
PCT/JP2023/025935 WO2024029312A1 (ja) 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体

Publications (3)

Publication Number Publication Date
JPWO2024029312A1 JPWO2024029312A1 (https=) 2024-02-08
JPWO2024029312A5 true JPWO2024029312A5 (https=) 2024-11-07
JP7727893B2 JP7727893B2 (ja) 2025-08-22

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ID=87201239

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JP2022124303A Active JP7310996B1 (ja) 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2023109572A Withdrawn JP2024022492A (ja) 2022-08-03 2023-07-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2024513206A Active JP7727893B2 (ja) 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体

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JP2022124303A Active JP7310996B1 (ja) 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2023109572A Withdrawn JP2024022492A (ja) 2022-08-03 2023-07-03 電磁波吸収体用熱可塑性樹脂組成物および成形体

Country Status (3)

Country Link
JP (3) JP7310996B1 (https=)
CN (1) CN119278239A (https=)
WO (1) WO2024029312A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7310996B1 (ja) * 2022-08-03 2023-07-19 東洋インキScホールディングス株式会社 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP7848853B1 (ja) * 2024-12-20 2026-04-21 artience株式会社 電磁波吸収体用熱可塑性樹脂組成物、及び成形体
CN121495344A (zh) * 2026-01-12 2026-02-10 上海聚威新材料股份有限公司 高频吸波材料及其制备方法与用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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CN104837926B (zh) 2013-12-06 2017-10-13 Lg化学株式会社 用于雷达罩的热塑性树脂组合物
JP2016108524A (ja) 2014-12-04 2016-06-20 東洋インキScホールディングス株式会社 導電性樹脂組成物、導電性マスターバッチ、成形体およびその製造方法
JP5983850B1 (ja) 2015-11-18 2016-09-06 東洋インキScホールディングス株式会社 導電性樹脂組成物、成形体およびその製造方法
JP6780363B2 (ja) 2016-08-19 2020-11-04 東洋インキScホールディングス株式会社 導電性樹脂組成物、成形体およびその製造方法
JP7279994B2 (ja) 2018-03-26 2023-05-23 積水テクノ成型株式会社 樹脂成形体
JP7310996B1 (ja) * 2022-08-03 2023-07-19 東洋インキScホールディングス株式会社 電磁波吸収体用熱可塑性樹脂組成物および成形体

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