JPWO2024029312A1 - - Google Patents
Info
- Publication number
- JPWO2024029312A1 JPWO2024029312A1 JP2024513206A JP2024513206A JPWO2024029312A1 JP WO2024029312 A1 JPWO2024029312 A1 JP WO2024029312A1 JP 2024513206 A JP2024513206 A JP 2024513206A JP 2024513206 A JP2024513206 A JP 2024513206A JP WO2024029312 A1 JPWO2024029312 A1 JP WO2024029312A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Aerials With Secondary Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022124303A JP7310996B1 (ja) | 2022-08-03 | 2022-08-03 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
| PCT/JP2023/025935 WO2024029312A1 (ja) | 2022-08-03 | 2023-07-13 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029312A1 true JPWO2024029312A1 (https=) | 2024-02-08 |
| JPWO2024029312A5 JPWO2024029312A5 (https=) | 2024-11-07 |
| JP7727893B2 JP7727893B2 (ja) | 2025-08-22 |
Family
ID=87201239
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022124303A Active JP7310996B1 (ja) | 2022-08-03 | 2022-08-03 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
| JP2023109572A Withdrawn JP2024022492A (ja) | 2022-08-03 | 2023-07-03 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
| JP2024513206A Active JP7727893B2 (ja) | 2022-08-03 | 2023-07-13 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022124303A Active JP7310996B1 (ja) | 2022-08-03 | 2022-08-03 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
| JP2023109572A Withdrawn JP2024022492A (ja) | 2022-08-03 | 2023-07-03 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
Country Status (3)
| Country | Link |
|---|---|
| JP (3) | JP7310996B1 (https=) |
| CN (1) | CN119278239A (https=) |
| WO (1) | WO2024029312A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7310996B1 (ja) * | 2022-08-03 | 2023-07-19 | 東洋インキScホールディングス株式会社 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
| JP7848853B1 (ja) * | 2024-12-20 | 2026-04-21 | artience株式会社 | 電磁波吸収体用熱可塑性樹脂組成物、及び成形体 |
| CN121495344A (zh) * | 2026-01-12 | 2026-02-10 | 上海聚威新材料股份有限公司 | 高频吸波材料及其制备方法与用途 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016504471A (ja) * | 2013-12-06 | 2016-02-12 | エルジー・ケム・リミテッド | レーダーカバー用熱可塑性樹脂組成物 |
| JP2016108524A (ja) * | 2014-12-04 | 2016-06-20 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、導電性マスターバッチ、成形体およびその製造方法 |
| JP2017095525A (ja) * | 2015-11-18 | 2017-06-01 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、成形体およびその製造方法 |
| JP2018028031A (ja) * | 2016-08-19 | 2018-02-22 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、成形体およびその製造方法 |
| JP2019176143A (ja) * | 2018-03-26 | 2019-10-10 | 積水テクノ成型株式会社 | 樹脂成形体 |
| JP7310996B1 (ja) * | 2022-08-03 | 2023-07-19 | 東洋インキScホールディングス株式会社 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
-
2022
- 2022-08-03 JP JP2022124303A patent/JP7310996B1/ja active Active
-
2023
- 2023-07-03 JP JP2023109572A patent/JP2024022492A/ja not_active Withdrawn
- 2023-07-13 WO PCT/JP2023/025935 patent/WO2024029312A1/ja not_active Ceased
- 2023-07-13 CN CN202380043301.XA patent/CN119278239A/zh active Pending
- 2023-07-13 JP JP2024513206A patent/JP7727893B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016504471A (ja) * | 2013-12-06 | 2016-02-12 | エルジー・ケム・リミテッド | レーダーカバー用熱可塑性樹脂組成物 |
| JP2016108524A (ja) * | 2014-12-04 | 2016-06-20 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、導電性マスターバッチ、成形体およびその製造方法 |
| JP2017095525A (ja) * | 2015-11-18 | 2017-06-01 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、成形体およびその製造方法 |
| JP2018028031A (ja) * | 2016-08-19 | 2018-02-22 | 東洋インキScホールディングス株式会社 | 導電性樹脂組成物、成形体およびその製造方法 |
| JP2019176143A (ja) * | 2018-03-26 | 2019-10-10 | 積水テクノ成型株式会社 | 樹脂成形体 |
| JP7310996B1 (ja) * | 2022-08-03 | 2023-07-19 | 東洋インキScホールディングス株式会社 | 電磁波吸収体用熱可塑性樹脂組成物および成形体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7727893B2 (ja) | 2025-08-22 |
| JP7310996B1 (ja) | 2023-07-19 |
| JP2024021468A (ja) | 2024-02-16 |
| CN119278239A (zh) | 2025-01-07 |
| WO2024029312A1 (ja) | 2024-02-08 |
| JP2024022492A (ja) | 2024-02-16 |
| WO2024029312A8 (ja) | 2024-03-14 |
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