JP7310996B1 - 電磁波吸収体用熱可塑性樹脂組成物および成形体 - Google Patents

電磁波吸収体用熱可塑性樹脂組成物および成形体 Download PDF

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Publication number
JP7310996B1
JP7310996B1 JP2022124303A JP2022124303A JP7310996B1 JP 7310996 B1 JP7310996 B1 JP 7310996B1 JP 2022124303 A JP2022124303 A JP 2022124303A JP 2022124303 A JP2022124303 A JP 2022124303A JP 7310996 B1 JP7310996 B1 JP 7310996B1
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Japan
Prior art keywords
thermoplastic resin
electromagnetic wave
resin composition
mass
carbon
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JP2022124303A
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English (en)
Japanese (ja)
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JP2024021468A (ja
Inventor
悠太 小林
萌 大川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Artience Co Ltd
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Toyo Ink SC Holdings Co Ltd
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Publication date
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Priority to JP2022124303A priority Critical patent/JP7310996B1/ja
Priority to JP2023109572A priority patent/JP2024022492A/ja
Priority to JP2024513206A priority patent/JP7727893B2/ja
Priority to CN202380043301.XA priority patent/CN119278239A/zh
Priority to PCT/JP2023/025935 priority patent/WO2024029312A1/ja
Application granted granted Critical
Publication of JP7310996B1 publication Critical patent/JP7310996B1/ja
Publication of JP2024021468A publication Critical patent/JP2024021468A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2022124303A 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体 Active JP7310996B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022124303A JP7310996B1 (ja) 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2023109572A JP2024022492A (ja) 2022-08-03 2023-07-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2024513206A JP7727893B2 (ja) 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体
CN202380043301.XA CN119278239A (zh) 2022-08-03 2023-07-13 电磁波吸收体用热塑性树脂组合物以及成形体
PCT/JP2023/025935 WO2024029312A1 (ja) 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体

Applications Claiming Priority (1)

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JP2022124303A JP7310996B1 (ja) 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体

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JP2023109572A Division JP2024022492A (ja) 2022-08-03 2023-07-03 電磁波吸収体用熱可塑性樹脂組成物および成形体

Publications (2)

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JP7310996B1 true JP7310996B1 (ja) 2023-07-19
JP2024021468A JP2024021468A (ja) 2024-02-16

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JP2022124303A Active JP7310996B1 (ja) 2022-08-03 2022-08-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2023109572A Withdrawn JP2024022492A (ja) 2022-08-03 2023-07-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2024513206A Active JP7727893B2 (ja) 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体

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JP2023109572A Withdrawn JP2024022492A (ja) 2022-08-03 2023-07-03 電磁波吸収体用熱可塑性樹脂組成物および成形体
JP2024513206A Active JP7727893B2 (ja) 2022-08-03 2023-07-13 電磁波吸収体用熱可塑性樹脂組成物および成形体

Country Status (3)

Country Link
JP (3) JP7310996B1 (https=)
CN (1) CN119278239A (https=)
WO (1) WO2024029312A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024029312A1 (https=) * 2022-08-03 2024-02-08

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7848853B1 (ja) * 2024-12-20 2026-04-21 ａｒｔｉｅｎｃｅ株式会社 電磁波吸収体用熱可塑性樹脂組成物、及び成形体
CN121495344A (zh) * 2026-01-12 2026-02-10 上海聚威新材料股份有限公司 高频吸波材料及其制备方法与用途

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016504471A (ja) 2013-12-06 2016-02-12 エルジー・ケム・リミテッド レーダーカバー用熱可塑性樹脂組成物
JP2016108524A (ja) 2014-12-04 2016-06-20 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、導電性マスターバッチ、成形体およびその製造方法
JP2017095525A (ja) 2015-11-18 2017-06-01 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、成形体およびその製造方法
JP2018028031A (ja) 2016-08-19 2018-02-22 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、成形体およびその製造方法
JP2019176143A (ja) 2018-03-26 2019-10-10 積水テクノ成型株式会社 樹脂成形体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7310996B1 (ja) * 2022-08-03 2023-07-19 東洋インキＳｃホールディングス株式会社 電磁波吸収体用熱可塑性樹脂組成物および成形体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016504471A (ja) 2013-12-06 2016-02-12 エルジー・ケム・リミテッド レーダーカバー用熱可塑性樹脂組成物
JP2016108524A (ja) 2014-12-04 2016-06-20 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、導電性マスターバッチ、成形体およびその製造方法
JP2017095525A (ja) 2015-11-18 2017-06-01 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、成形体およびその製造方法
JP2018028031A (ja) 2016-08-19 2018-02-22 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物、成形体およびその製造方法
JP2019176143A (ja) 2018-03-26 2019-10-10 積水テクノ成型株式会社 樹脂成形体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024029312A1 (https=) * 2022-08-03 2024-02-08

Also Published As

Publication number Publication date
JP7727893B2 (ja) 2025-08-22
JP2024021468A (ja) 2024-02-16
CN119278239A (zh) 2025-01-07
WO2024029312A1 (ja) 2024-02-08
JP2024022492A (ja) 2024-02-16
WO2024029312A8 (ja) 2024-03-14
JPWO2024029312A1 (https=) 2024-02-08

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