JPWO2024029286A1 - - Google Patents
Info
- Publication number
- JPWO2024029286A1 JPWO2024029286A1 JP2024538890A JP2024538890A JPWO2024029286A1 JP WO2024029286 A1 JPWO2024029286 A1 JP WO2024029286A1 JP 2024538890 A JP2024538890 A JP 2024538890A JP 2024538890 A JP2024538890 A JP 2024538890A JP WO2024029286 A1 JPWO2024029286 A1 JP WO2024029286A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022123758 | 2022-08-03 | ||
| PCT/JP2023/025566 WO2024029286A1 (ja) | 2022-08-03 | 2023-07-11 | 半導体装置、および、半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029286A1 true JPWO2024029286A1 (https=) | 2024-02-08 |
| JPWO2024029286A5 JPWO2024029286A5 (https=) | 2025-04-11 |
Family
ID=89849207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538890A Pending JPWO2024029286A1 (https=) | 2022-08-03 | 2023-07-11 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024029286A1 (https=) |
| WO (1) | WO2024029286A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000012605A (ja) * | 1998-06-18 | 2000-01-14 | World Metal:Kk | 半導体チップの電極部の形成方法 |
| JP2007149714A (ja) * | 2005-11-24 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 基板およびその形成方法および半導体装置 |
| JP2009293986A (ja) * | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
| JP2010258286A (ja) * | 2009-04-27 | 2010-11-11 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| JP5062283B2 (ja) * | 2009-04-30 | 2012-10-31 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
| JP6159125B2 (ja) * | 2013-04-04 | 2017-07-05 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| CN105190858B (zh) * | 2013-04-25 | 2018-11-06 | 富士电机株式会社 | 半导体装置及半导体装置的制造方法 |
| JP2015037151A (ja) * | 2013-08-15 | 2015-02-23 | サンケン電気株式会社 | 半導体装置 |
| JP2015142059A (ja) * | 2014-01-30 | 2015-08-03 | 株式会社日立製作所 | パワー半導体モジュール |
| JP2019004137A (ja) * | 2017-05-29 | 2019-01-10 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP7052444B2 (ja) * | 2018-03-15 | 2022-04-12 | 住友大阪セメント株式会社 | 光変調器、及び光伝送装置 |
| JP7383881B2 (ja) * | 2019-01-16 | 2023-11-21 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
-
2023
- 2023-07-11 WO PCT/JP2023/025566 patent/WO2024029286A1/ja not_active Ceased
- 2023-07-11 JP JP2024538890A patent/JPWO2024029286A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024029286A1 (ja) | 2024-02-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250107 |