JPWO2024024783A5 - - Google Patents

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Publication number
JPWO2024024783A5
JPWO2024024783A5 JP2024537747A JP2024537747A JPWO2024024783A5 JP WO2024024783 A5 JPWO2024024783 A5 JP WO2024024783A5 JP 2024537747 A JP2024537747 A JP 2024537747A JP 2024537747 A JP2024537747 A JP 2024537747A JP WO2024024783 A5 JPWO2024024783 A5 JP WO2024024783A5
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JP
Japan
Prior art keywords
photosensitive layer
transfer film
film according
compound
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024537747A
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English (en)
Japanese (ja)
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JPWO2024024783A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/027215 external-priority patent/WO2024024783A1/ja
Publication of JPWO2024024783A1 publication Critical patent/JPWO2024024783A1/ja
Publication of JPWO2024024783A5 publication Critical patent/JPWO2024024783A5/ja
Pending legal-status Critical Current

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JP2024537747A 2022-07-29 2023-07-25 Pending JPWO2024024783A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022122024 2022-07-29
PCT/JP2023/027215 WO2024024783A1 (ja) 2022-07-29 2023-07-25 転写フィルム、積層体の製造方法、積層体、半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPWO2024024783A1 JPWO2024024783A1 (https=) 2024-02-01
JPWO2024024783A5 true JPWO2024024783A5 (https=) 2025-04-16

Family

ID=89706373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024537747A Pending JPWO2024024783A1 (https=) 2022-07-29 2023-07-25

Country Status (3)

Country Link
JP (1) JPWO2024024783A1 (https=)
TW (1) TW202413097A (https=)
WO (1) WO2024024783A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008070477A (ja) * 2006-09-12 2008-03-27 Nippon Steel Chem Co Ltd 感光性樹脂フィルムとこれを用いた回路基板の製造方法
EP3478777B1 (en) * 2017-09-11 2020-11-18 FUJIFILM Electronic Materials U.S.A., Inc. Dielectric film forming composition
JP2020154205A (ja) * 2019-03-22 2020-09-24 富士フイルム株式会社 パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス
WO2021002395A1 (ja) * 2019-07-02 2021-01-07 富士フイルム株式会社 ネガ型硬化性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

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