JPWO2024018827A1 - - Google Patents
Info
- Publication number
- JPWO2024018827A1 JPWO2024018827A1 JP2024534991A JP2024534991A JPWO2024018827A1 JP WO2024018827 A1 JPWO2024018827 A1 JP WO2024018827A1 JP 2024534991 A JP2024534991 A JP 2024534991A JP 2024534991 A JP2024534991 A JP 2024534991A JP WO2024018827 A1 JPWO2024018827 A1 JP WO2024018827A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022116202 | 2022-07-21 | ||
| PCT/JP2023/023347 WO2024018827A1 (ja) | 2022-07-21 | 2023-06-23 | 半導体装置および半導体装置アッセンブリ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024018827A1 true JPWO2024018827A1 (https=) | 2024-01-25 |
| JPWO2024018827A5 JPWO2024018827A5 (https=) | 2025-03-31 |
Family
ID=89617611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024534991A Pending JPWO2024018827A1 (https=) | 2022-07-21 | 2023-06-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024018827A1 (https=) |
| WO (1) | WO2024018827A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11154720A (ja) * | 1997-11-20 | 1999-06-08 | Fuji Electric Co Ltd | インバータ |
| JP4753642B2 (ja) * | 2005-07-04 | 2011-08-24 | 株式会社リコー | 電子部品実装体の製造方法 |
| JP5909396B2 (ja) * | 2012-03-26 | 2016-04-26 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
| JP6625037B2 (ja) * | 2016-11-17 | 2019-12-25 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
-
2023
- 2023-06-23 WO PCT/JP2023/023347 patent/WO2024018827A1/ja not_active Ceased
- 2023-06-23 JP JP2024534991A patent/JPWO2024018827A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024018827A1 (ja) | 2024-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CL2025004118A1 (es) | Composiciones y métodos de inhibición de la adenilato ciclasa 9 (ac9). | |
| JPWO2024185420A1 (https=) | ||
| JPWO2024018827A1 (https=) | ||
| BR102023010976A2 (https=) | ||
| BR102023009641A2 (https=) | ||
| CN307045679S (https=) | ||
| CN307046108S (https=) | ||
| CN307049784S (https=) | ||
| BY13166U (https=) | ||
| BY13165U (https=) | ||
| CN307049568S (https=) | ||
| CN307049479S (https=) | ||
| CN307049373S (https=) | ||
| CN307047691S (https=) | ||
| CN307047684S (https=) | ||
| BY13164U (https=) | ||
| BY13163U (https=) | ||
| CN307047601S (https=) | ||
| BY13158U (https=) | ||
| CN307046249S (https=) | ||
| BY13159U (https=) | ||
| CN307046016S (https=) | ||
| BY13168U (https=) | ||
| BY13161U (https=) | ||
| BY13162U (https=) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241212 |