JPWO2023286700A1 - - Google Patents

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Publication number
JPWO2023286700A1
JPWO2023286700A1 JP2023534769A JP2023534769A JPWO2023286700A1 JP WO2023286700 A1 JPWO2023286700 A1 JP WO2023286700A1 JP 2023534769 A JP2023534769 A JP 2023534769A JP 2023534769 A JP2023534769 A JP 2023534769A JP WO2023286700 A1 JPWO2023286700 A1 JP WO2023286700A1
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JP
Japan
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JP2023534769A
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Japanese (ja)
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JP7825292B2 (ja
JPWO2023286700A5 (https=
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Publication of JPWO2023286700A1 publication Critical patent/JPWO2023286700A1/ja
Publication of JPWO2023286700A5 publication Critical patent/JPWO2023286700A5/ja
Application granted granted Critical
Publication of JP7825292B2 publication Critical patent/JP7825292B2/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/04Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66Mercaptans
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02Polythioethers; Polythioether-ethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
JP2023534769A 2021-07-14 2022-07-08 硬化性樹脂組成物 Active JP7825292B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021116459 2021-07-14
JP2021116459 2021-07-14
PCT/JP2022/027060 WO2023286700A1 (ja) 2021-07-14 2022-07-08 硬化性樹脂組成物

Publications (3)

Publication Number Publication Date
JPWO2023286700A1 true JPWO2023286700A1 (https=) 2023-01-19
JPWO2023286700A5 JPWO2023286700A5 (https=) 2024-11-07
JP7825292B2 JP7825292B2 (ja) 2026-03-06

Family

ID=84919385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023534769A Active JP7825292B2 (ja) 2021-07-14 2022-07-08 硬化性樹脂組成物

Country Status (6)

Country Link
EP (1) EP4372030B1 (https=)
JP (1) JP7825292B2 (https=)
KR (1) KR20240032948A (https=)
CN (1) CN117642454A (https=)
TW (1) TW202311431A (https=)
WO (1) WO2023286700A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116790214B (zh) * 2023-05-18 2024-04-12 浙江羲和新材料科技有限公司 密封剂组合物及其在液晶显示元件中的应用
DE102024131652A1 (de) 2024-10-30 2026-04-30 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Härtbare Masse auf Basis von thiolhärtenden Epoxiden und Verwendung zum Verkleben, Vergießen, Abdichten und/oder Beschichten

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302759A (ja) * 2002-04-10 2003-10-24 Toagosei Co Ltd 感光性パターン形成用硬化性樹脂組成物、カラーフィルター、及び、液晶パネル
WO2012147712A1 (ja) * 2011-04-28 2012-11-01 三菱瓦斯化学株式会社 硬化性組成物および光学用接着剤
WO2012164869A1 (ja) * 2011-05-31 2012-12-06 日油株式会社 硬化性樹脂組成物
JP2013043902A (ja) * 2011-08-22 2013-03-04 Nippon Shokubai Co Ltd 硬化性樹脂組成物及び硬化物
JP2014141621A (ja) * 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd 紫外線硬化性組成物
WO2016114268A1 (ja) * 2015-01-13 2016-07-21 日油株式会社 硬化性樹脂組成物
JP2017210475A (ja) * 2016-05-23 2017-11-30 株式会社サクラクレパス 光硬化性人工爪組成物
WO2018155013A1 (ja) * 2017-02-22 2018-08-30 日産化学工業株式会社 インプリント用光硬化性組成物
JP2021075698A (ja) * 2019-10-31 2021-05-20 味の素株式会社 硬化性組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012153794A (ja) 2011-01-26 2012-08-16 Sakai Chem Ind Co Ltd 樹脂組成物、樹脂硬化物および樹脂成形体
JP4976575B1 (ja) 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
JP6002857B1 (ja) * 2014-11-17 2016-10-05 積水化学工業株式会社 インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品
JP6699145B2 (ja) * 2015-11-30 2020-05-27 味の素株式会社 光および熱硬化性樹脂組成物
CN110431168B (zh) 2017-03-29 2022-04-29 味之素株式会社 固化性组合物及构造物
DE102017129780A1 (de) * 2017-12-13 2019-06-13 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Lichtfixierbare und warmhärtende Massen auf Basis von Epoxidharzen und Thiolen
JP2021116459A (ja) 2020-01-27 2021-08-10 金澤工業株式会社 電解槽および電解装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302759A (ja) * 2002-04-10 2003-10-24 Toagosei Co Ltd 感光性パターン形成用硬化性樹脂組成物、カラーフィルター、及び、液晶パネル
WO2012147712A1 (ja) * 2011-04-28 2012-11-01 三菱瓦斯化学株式会社 硬化性組成物および光学用接着剤
WO2012164869A1 (ja) * 2011-05-31 2012-12-06 日油株式会社 硬化性樹脂組成物
JP2013043902A (ja) * 2011-08-22 2013-03-04 Nippon Shokubai Co Ltd 硬化性樹脂組成物及び硬化物
JP2014141621A (ja) * 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd 紫外線硬化性組成物
WO2016114268A1 (ja) * 2015-01-13 2016-07-21 日油株式会社 硬化性樹脂組成物
JP2017210475A (ja) * 2016-05-23 2017-11-30 株式会社サクラクレパス 光硬化性人工爪組成物
WO2018155013A1 (ja) * 2017-02-22 2018-08-30 日産化学工業株式会社 インプリント用光硬化性組成物
JP2021075698A (ja) * 2019-10-31 2021-05-20 味の素株式会社 硬化性組成物

Also Published As

Publication number Publication date
CN117642454A (zh) 2024-03-01
JP7825292B2 (ja) 2026-03-06
TW202311431A (zh) 2023-03-16
KR20240032948A (ko) 2024-03-12
EP4372030A1 (en) 2024-05-22
EP4372030C0 (en) 2026-03-25
EP4372030B1 (en) 2026-03-25
EP4372030A4 (en) 2025-08-06
WO2023286700A1 (ja) 2023-01-19

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