JPWO2023195202A1 - - Google Patents

Info

Publication number
JPWO2023195202A1
JPWO2023195202A1 JP2024514151A JP2024514151A JPWO2023195202A1 JP WO2023195202 A1 JPWO2023195202 A1 JP WO2023195202A1 JP 2024514151 A JP2024514151 A JP 2024514151A JP 2024514151 A JP2024514151 A JP 2024514151A JP WO2023195202 A1 JPWO2023195202 A1 JP WO2023195202A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024514151A
Other languages
Japanese (ja)
Other versions
JP7845459B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023195202A1 publication Critical patent/JPWO2023195202A1/ja
Application granted granted Critical
Publication of JP7845459B2 publication Critical patent/JP7845459B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024514151A 2022-04-06 2022-12-13 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置 Active JP7845459B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022063655 2022-04-06
JP2022063655 2022-04-06
PCT/JP2022/045898 WO2023195202A1 (ja) 2022-04-06 2022-12-13 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023195202A1 true JPWO2023195202A1 (https=) 2023-10-12
JP7845459B2 JP7845459B2 (ja) 2026-04-14

Family

ID=88242644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514151A Active JP7845459B2 (ja) 2022-04-06 2022-12-13 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置

Country Status (3)

Country Link
JP (1) JP7845459B2 (https=)
TW (1) TW202341284A (https=)
WO (1) WO2023195202A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008033158A (ja) * 2006-07-31 2008-02-14 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
JP2009265520A (ja) * 2008-04-28 2009-11-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
JP2012188633A (ja) * 2011-03-14 2012-10-04 Panasonic Corp 熱硬化性樹脂組成物、金属箔付き樹脂シート、及びフレキシブルプリント配線板
JP2014052592A (ja) * 2012-09-10 2014-03-20 Hitachi Chemical Co Ltd 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
WO2016001949A1 (ja) * 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
JP2016009159A (ja) * 2014-06-26 2016-01-18 日立化成株式会社 ポジ型感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2020094194A (ja) * 2018-11-30 2020-06-18 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜のレリーフパターンの製造方法、保護膜、絶縁膜、電子部品および表示装置
JP2021197430A (ja) * 2020-06-12 2021-12-27 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008033158A (ja) * 2006-07-31 2008-02-14 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
JP2009265520A (ja) * 2008-04-28 2009-11-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
JP2012188633A (ja) * 2011-03-14 2012-10-04 Panasonic Corp 熱硬化性樹脂組成物、金属箔付き樹脂シート、及びフレキシブルプリント配線板
JP2014052592A (ja) * 2012-09-10 2014-03-20 Hitachi Chemical Co Ltd 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2016009159A (ja) * 2014-06-26 2016-01-18 日立化成株式会社 ポジ型感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
WO2016001949A1 (ja) * 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
JP2020094194A (ja) * 2018-11-30 2020-06-18 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜のレリーフパターンの製造方法、保護膜、絶縁膜、電子部品および表示装置
JP2021197430A (ja) * 2020-06-12 2021-12-27 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP7845459B2 (ja) 2026-04-14
TW202341284A (zh) 2023-10-16
WO2023195202A1 (ja) 2023-10-12

Similar Documents

Publication Publication Date Title
JPWO2023195322A1 (https=)
JPWO2024009969A1 (https=)
BR102022025291A2 (https=)
BR202022009269U2 (https=)
BY13158U (https=)
BY13160U (https=)
CN307049580S (https=)
CN307048959S (https=)
CN307048853S (https=)
CN307048567S (https=)
CN307048529S (https=)
CN307048116S (https=)
CN307047344S (https=)
CN307046950S (https=)
CN307046771S (https=)
CN307045528S (https=)
CN307045165S (https=)
CN307044523S (https=)
BY23965C1 (https=)
BY23963C1 (https=)
BY13176U (https=)
BY13175U (https=)
BY13174U (https=)
BY13172U (https=)
BY13170U (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240819

AA64 Notification of invalidation of claim of internal priority (with term)

Free format text: JAPANESE INTERMEDIATE CODE: A241764

Effective date: 20241022

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241223

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250729

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250929

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251127

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260316