JP7845459B2 - ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置 - Google Patents

ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置

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Publication number
JP7845459B2
JP7845459B2 JP2024514151A JP2024514151A JP7845459B2 JP 7845459 B2 JP7845459 B2 JP 7845459B2 JP 2024514151 A JP2024514151 A JP 2024514151A JP 2024514151 A JP2024514151 A JP 2024514151A JP 7845459 B2 JP7845459 B2 JP 7845459B2
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Japan
Prior art keywords
insulating film
group
organic insulating
forming material
acid
Prior art date
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JP2024514151A
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English (en)
Japanese (ja)
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JPWO2023195202A1 (https=
Inventor
聡 米田
憲哉 足立
香織 小林
大作 松川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HD MicroSystems Ltd
Original Assignee
HD MicroSystems Ltd
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Publication date
Application filed by HD MicroSystems Ltd filed Critical HD MicroSystems Ltd
Publication of JPWO2023195202A1 publication Critical patent/JPWO2023195202A1/ja
Application granted granted Critical
Publication of JP7845459B2 publication Critical patent/JP7845459B2/ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024514151A 2022-04-06 2022-12-13 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置 Active JP7845459B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022063655 2022-04-06
JP2022063655 2022-04-06
PCT/JP2022/045898 WO2023195202A1 (ja) 2022-04-06 2022-12-13 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023195202A1 JPWO2023195202A1 (https=) 2023-10-12
JP7845459B2 true JP7845459B2 (ja) 2026-04-14

Family

ID=88242644

Family Applications (1)

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JP2024514151A Active JP7845459B2 (ja) 2022-04-06 2022-12-13 ハイブリッドボンディング絶縁膜形成材料、半導体装置の製造方法及び半導体装置

Country Status (3)

Country Link
JP (1) JP7845459B2 (https=)
TW (1) TW202341284A (https=)
WO (1) WO2023195202A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009265520A (ja) 2008-04-28 2009-11-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
JP2012188633A (ja) 2011-03-14 2012-10-04 Panasonic Corp 熱硬化性樹脂組成物、金属箔付き樹脂シート、及びフレキシブルプリント配線板
JP2014052592A (ja) 2012-09-10 2014-03-20 Hitachi Chemical Co Ltd 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
WO2016001949A1 (ja) 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
JP2016009159A (ja) 2014-06-26 2016-01-18 日立化成株式会社 ポジ型感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2021197430A (ja) 2020-06-12 2021-12-27 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4840014B2 (ja) * 2006-07-31 2011-12-21 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
JP2020094194A (ja) * 2018-11-30 2020-06-18 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜のレリーフパターンの製造方法、保護膜、絶縁膜、電子部品および表示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009265520A (ja) 2008-04-28 2009-11-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
JP2012188633A (ja) 2011-03-14 2012-10-04 Panasonic Corp 熱硬化性樹脂組成物、金属箔付き樹脂シート、及びフレキシブルプリント配線板
JP2014052592A (ja) 2012-09-10 2014-03-20 Hitachi Chemical Co Ltd 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2016009159A (ja) 2014-06-26 2016-01-18 日立化成株式会社 ポジ型感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
WO2016001949A1 (ja) 2014-07-02 2016-01-07 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、ポリアミド、接着性シート、硬化物およびプリント配線板
JP2021197430A (ja) 2020-06-12 2021-12-27 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
TW202341284A (zh) 2023-10-16
JPWO2023195202A1 (https=) 2023-10-12
WO2023195202A1 (ja) 2023-10-12

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