JPWO2023189840A5 - - Google Patents

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Publication number
JPWO2023189840A5
JPWO2023189840A5 JP2024511897A JP2024511897A JPWO2023189840A5 JP WO2023189840 A5 JPWO2023189840 A5 JP WO2023189840A5 JP 2024511897 A JP2024511897 A JP 2024511897A JP 2024511897 A JP2024511897 A JP 2024511897A JP WO2023189840 A5 JPWO2023189840 A5 JP WO2023189840A5
Authority
JP
Japan
Prior art keywords
semiconductor device
terminal
thickness
conductive member
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511897A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189840A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/010950 external-priority patent/WO2023189840A1/ja
Publication of JPWO2023189840A1 publication Critical patent/JPWO2023189840A1/ja
Publication of JPWO2023189840A5 publication Critical patent/JPWO2023189840A5/ja
Pending legal-status Critical Current

Links

JP2024511897A 2022-03-30 2023-03-20 Pending JPWO2023189840A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022055492 2022-03-30
PCT/JP2023/010950 WO2023189840A1 (ja) 2022-03-30 2023-03-20 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023189840A1 JPWO2023189840A1 (cg-RX-API-DMAC7.html) 2023-10-05
JPWO2023189840A5 true JPWO2023189840A5 (cg-RX-API-DMAC7.html) 2024-12-12

Family

ID=88201264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511897A Pending JPWO2023189840A1 (cg-RX-API-DMAC7.html) 2022-03-30 2023-03-20

Country Status (5)

Country Link
US (1) US20240429154A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023189840A1 (cg-RX-API-DMAC7.html)
CN (1) CN118974924A (cg-RX-API-DMAC7.html)
DE (1) DE112023001210T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023189840A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11211312B2 (en) * 2017-11-20 2021-12-28 Rohm Co., Ltd. Semiconductor device
JP2021190505A (ja) 2020-05-27 2021-12-13 ローム株式会社 半導体装置
JP7673069B2 (ja) * 2020-08-05 2025-05-08 ローム株式会社 半導体装置

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