JPWO2023017707A5 - - Google Patents

Info

Publication number
JPWO2023017707A5
JPWO2023017707A5 JP2023541380A JP2023541380A JPWO2023017707A5 JP WO2023017707 A5 JPWO2023017707 A5 JP WO2023017707A5 JP 2023541380 A JP2023541380 A JP 2023541380A JP 2023541380 A JP2023541380 A JP 2023541380A JP WO2023017707 A5 JPWO2023017707 A5 JP WO2023017707A5
Authority
JP
Japan
Prior art keywords
conductive
semiconductor device
semiconductor
thickness direction
conductive member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023541380A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023017707A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/027699 external-priority patent/WO2023017707A1/ja
Publication of JPWO2023017707A1 publication Critical patent/JPWO2023017707A1/ja
Publication of JPWO2023017707A5 publication Critical patent/JPWO2023017707A5/ja
Pending legal-status Critical Current

Links

JP2023541380A 2021-08-10 2022-07-14 Pending JPWO2023017707A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130755 2021-08-10
PCT/JP2022/027699 WO2023017707A1 (ja) 2021-08-10 2022-07-14 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023017707A1 JPWO2023017707A1 (cg-RX-API-DMAC7.html) 2023-02-16
JPWO2023017707A5 true JPWO2023017707A5 (cg-RX-API-DMAC7.html) 2025-07-15

Family

ID=85199939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023541380A Pending JPWO2023017707A1 (cg-RX-API-DMAC7.html) 2021-08-10 2022-07-14

Country Status (5)

Country Link
US (1) US20240234361A9 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023017707A1 (cg-RX-API-DMAC7.html)
CN (1) CN117795675A (cg-RX-API-DMAC7.html)
DE (1) DE112022003321T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023017707A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6300633B2 (ja) 2014-05-20 2018-03-28 三菱電機株式会社 パワーモジュール
US11211312B2 (en) * 2017-11-20 2021-12-28 Rohm Co., Ltd. Semiconductor device
JP7292155B2 (ja) * 2019-08-28 2023-06-16 三菱電機株式会社 半導体装置

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