JPWO2023163101A1 - - Google Patents
Info
- Publication number
- JPWO2023163101A1 JPWO2023163101A1 JP2024503256A JP2024503256A JPWO2023163101A1 JP WO2023163101 A1 JPWO2023163101 A1 JP WO2023163101A1 JP 2024503256 A JP2024503256 A JP 2024503256A JP 2024503256 A JP2024503256 A JP 2024503256A JP WO2023163101 A1 JPWO2023163101 A1 JP WO2023163101A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022029585 | 2022-02-28 | ||
| PCT/JP2023/006711 WO2023163101A1 (ja) | 2022-02-28 | 2023-02-24 | 積層体、配線基板、配線基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023163101A1 true JPWO2023163101A1 (https=) | 2023-08-31 |
Family
ID=87766116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024503256A Pending JPWO2023163101A1 (https=) | 2022-02-28 | 2023-02-24 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023163101A1 (https=) |
| TW (1) | TW202344396A (https=) |
| WO (1) | WO2023163101A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202536073A (zh) * | 2023-12-12 | 2025-09-16 | 日商東洋鋼鈑股份有限公司 | 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法，及液晶聚合物薄膜 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03152132A (ja) * | 1989-11-09 | 1991-06-28 | Unitika Ltd | 液晶ポリマーフィルムおよびその製造法 |
| JP2001081215A (ja) * | 1999-09-17 | 2001-03-27 | Kuraray Co Ltd | 高耐熱性フィルムおよびその製造方法 |
| JP4381961B2 (ja) * | 2004-11-10 | 2009-12-09 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムを用いた回路基板の製造方法 |
| JP5032957B2 (ja) * | 2007-11-28 | 2012-09-26 | ポリプラスチックス株式会社 | 全芳香族ポリエステル及びポリエステル樹脂組成物 |
| JP6133782B2 (ja) * | 2011-10-31 | 2017-05-24 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムならびにこれを用いた積層体および回路基板 |
| CN107109182B (zh) * | 2015-05-15 | 2019-06-07 | 东洋纺株式会社 | 含有低介电粘合剂层的层叠体 |
| JP6759873B2 (ja) * | 2015-09-03 | 2020-09-23 | 株式会社村田製作所 | フレキシブル銅張積層板の製造方法とフレキシブル銅張積層板 |
| JP2022021192A (ja) * | 2020-07-21 | 2022-02-02 | Ｅｎｅｏｓ株式会社 | 液晶ポリエステル樹脂、成形品、および電気電子部品 |
| WO2022138618A1 (ja) * | 2020-12-25 | 2022-06-30 | 富士フイルム株式会社 | 液晶ポリマーフィルム、高速通信用基板 |
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2023
- 2023-02-24 WO PCT/JP2023/006711 patent/WO2023163101A1/ja not_active Ceased
- 2023-02-24 TW TW112107034A patent/TW202344396A/zh unknown
- 2023-02-24 JP JP2024503256A patent/JPWO2023163101A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202344396A (zh) | 2023-11-16 |
| WO2023163101A1 (ja) | 2023-08-31 |