JPWO2023162722A1 - - Google Patents
Info
- Publication number
- JPWO2023162722A1 JPWO2023162722A1 JP2024503018A JP2024503018A JPWO2023162722A1 JP WO2023162722 A1 JPWO2023162722 A1 JP WO2023162722A1 JP 2024503018 A JP2024503018 A JP 2024503018A JP 2024503018 A JP2024503018 A JP 2024503018A JP WO2023162722 A1 JPWO2023162722 A1 JP WO2023162722A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/501—Inductive arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/10—Configurations of laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022027147 | 2022-02-24 | ||
| PCT/JP2023/004560 WO2023162722A1 (ja) | 2022-02-24 | 2023-02-10 | 半導体装置および半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162722A1 true JPWO2023162722A1 (https=) | 2023-08-31 |
| JPWO2023162722A5 JPWO2023162722A5 (https=) | 2024-10-29 |
Family
ID=87765789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024503018A Pending JPWO2023162722A1 (https=) | 2022-02-24 | 2023-02-10 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240404977A1 (https=) |
| JP (1) | JPWO2023162722A1 (https=) |
| CN (1) | CN118805253A (https=) |
| DE (1) | DE112023000690T5 (https=) |
| WO (1) | WO2023162722A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7559189B1 (ja) * | 2023-12-12 | 2024-10-01 | 東芝エレベータ株式会社 | 電力変換装置 |
| WO2025216041A1 (ja) * | 2024-04-10 | 2025-10-16 | ローム株式会社 | 半導体装置およびインバータシステム |
| WO2026004740A1 (ja) * | 2024-06-27 | 2026-01-02 | ローム株式会社 | 半導体装置および半導体モジュール |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243594A (ja) * | 2001-01-31 | 2003-08-29 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP5206188B2 (ja) * | 2008-07-15 | 2013-06-12 | 三菱電機株式会社 | 半導体装置 |
| US8338936B2 (en) | 2008-07-24 | 2012-12-25 | Infineon Technologies Ag | Semiconductor device and manufacturing method |
| JP2013258387A (ja) | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP6299568B2 (ja) * | 2014-11-25 | 2018-03-28 | トヨタ自動車株式会社 | 半導体装置 |
| JP7028553B2 (ja) * | 2016-11-24 | 2022-03-02 | 株式会社アムコー・テクノロジー・ジャパン | 半導体装置及びその製造方法 |
| JP7427927B2 (ja) * | 2019-11-19 | 2024-02-06 | 富士電機株式会社 | 半導体装置 |
| JP7367506B2 (ja) * | 2019-12-12 | 2023-10-24 | 株式会社プロテリアル | 半導体モジュール |
| JP7428017B2 (ja) * | 2020-03-06 | 2024-02-06 | 富士電機株式会社 | 半導体モジュール |
-
2023
- 2023-02-10 WO PCT/JP2023/004560 patent/WO2023162722A1/ja not_active Ceased
- 2023-02-10 DE DE112023000690.3T patent/DE112023000690T5/de active Pending
- 2023-02-10 JP JP2024503018A patent/JPWO2023162722A1/ja active Pending
- 2023-02-10 CN CN202380022925.3A patent/CN118805253A/zh active Pending
-
2024
- 2024-08-14 US US18/804,601 patent/US20240404977A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023000690T5 (de) | 2024-11-14 |
| US20240404977A1 (en) | 2024-12-05 |
| WO2023162722A1 (ja) | 2023-08-31 |
| CN118805253A (zh) | 2024-10-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240626 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260203 |