DE112023000690T5 - Halbleitervorrichtung und halbleitermodul - Google Patents

Halbleitervorrichtung und halbleitermodul Download PDF

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Publication number
DE112023000690T5
DE112023000690T5 DE112023000690.3T DE112023000690T DE112023000690T5 DE 112023000690 T5 DE112023000690 T5 DE 112023000690T5 DE 112023000690 T DE112023000690 T DE 112023000690T DE 112023000690 T5 DE112023000690 T5 DE 112023000690T5
Authority
DE
Germany
Prior art keywords
electrode
semiconductor device
wiring
semiconductor
center point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023000690.3T
Other languages
German (de)
English (en)
Inventor
Kazunori Fuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112023000690T5 publication Critical patent/DE112023000690T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
DE112023000690.3T 2022-02-24 2023-02-10 Halbleitervorrichtung und halbleitermodul Pending DE112023000690T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-027147 2022-02-24
JP2022027147 2022-02-24
PCT/JP2023/004560 WO2023162722A1 (ja) 2022-02-24 2023-02-10 半導体装置および半導体モジュール

Publications (1)

Publication Number Publication Date
DE112023000690T5 true DE112023000690T5 (de) 2024-11-14

Family

ID=87765789

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023000690.3T Pending DE112023000690T5 (de) 2022-02-24 2023-02-10 Halbleitervorrichtung und halbleitermodul

Country Status (5)

Country Link
US (1) US20240404977A1 (https=)
JP (1) JPWO2023162722A1 (https=)
CN (1) CN118805253A (https=)
DE (1) DE112023000690T5 (https=)
WO (1) WO2023162722A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7559189B1 (ja) * 2023-12-12 2024-10-01 東芝エレベータ株式会社 電力変換装置
WO2025216041A1 (ja) * 2024-04-10 2025-10-16 ローム株式会社 半導体装置およびインバータシステム
WO2026004740A1 (ja) * 2024-06-27 2026-01-02 ローム株式会社 半導体装置および半導体モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100019370A1 (en) 2008-07-24 2010-01-28 Infineon Technologies Ag Semiconductor device and manufacturing method
JP2013258387A (ja) 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243594A (ja) * 2001-01-31 2003-08-29 Sanyo Electric Co Ltd 半導体装置の製造方法
JP5206188B2 (ja) * 2008-07-15 2013-06-12 三菱電機株式会社 半導体装置
JP6299568B2 (ja) * 2014-11-25 2018-03-28 トヨタ自動車株式会社 半導体装置
JP7028553B2 (ja) * 2016-11-24 2022-03-02 株式会社アムコー・テクノロジー・ジャパン 半導体装置及びその製造方法
JP7427927B2 (ja) * 2019-11-19 2024-02-06 富士電機株式会社 半導体装置
JP7367506B2 (ja) * 2019-12-12 2023-10-24 株式会社プロテリアル 半導体モジュール
JP7428017B2 (ja) * 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100019370A1 (en) 2008-07-24 2010-01-28 Infineon Technologies Ag Semiconductor device and manufacturing method
JP2013258387A (ja) 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置

Also Published As

Publication number Publication date
JPWO2023162722A1 (https=) 2023-08-31
US20240404977A1 (en) 2024-12-05
WO2023162722A1 (ja) 2023-08-31
CN118805253A (zh) 2024-10-18

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000