JPWO2023162705A5 - - Google Patents
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- Publication number
- JPWO2023162705A5 JPWO2023162705A5 JP2023540575A JP2023540575A JPWO2023162705A5 JP WO2023162705 A5 JPWO2023162705 A5 JP WO2023162705A5 JP 2023540575 A JP2023540575 A JP 2023540575A JP 2023540575 A JP2023540575 A JP 2023540575A JP WO2023162705 A5 JPWO2023162705 A5 JP WO2023162705A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plate
- composite sheet
- sheet according
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022030025 | 2022-02-28 | ||
| JP2022030025 | 2022-02-28 | ||
| PCT/JP2023/004440 WO2023162705A1 (ja) | 2022-02-28 | 2023-02-09 | 複合シート、及び積層体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162705A1 JPWO2023162705A1 (https=) | 2023-08-31 |
| JP7374391B1 JP7374391B1 (ja) | 2023-11-06 |
| JPWO2023162705A5 true JPWO2023162705A5 (https=) | 2024-01-30 |
Family
ID=87765708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023540575A Active JP7374391B1 (ja) | 2022-02-28 | 2023-02-09 | 複合シート、及び積層体 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7374391B1 (https=) |
| WO (1) | WO2023162705A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9516741B2 (en) * | 2013-08-14 | 2016-12-06 | Denka Company Limited | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
| JP6189822B2 (ja) * | 2014-11-28 | 2017-08-30 | デンカ株式会社 | 窒化ホウ素樹脂複合体回路基板 |
| JP2019145744A (ja) * | 2018-02-23 | 2019-08-29 | イビデン株式会社 | 伝熱基板 |
| EP4144711A4 (en) * | 2020-05-15 | 2023-10-18 | Denka Company Limited | COMPOSITE, AND LAMINATE |
| CN115551819A (zh) * | 2020-05-15 | 2022-12-30 | 电化株式会社 | 复合体及复合体的制造方法 |
| JP7217391B1 (ja) * | 2021-03-31 | 2023-02-02 | デンカ株式会社 | 複合体及びその製造方法、並びに、積層体及びその製造方法 |
| JP7550869B2 (ja) * | 2021-03-31 | 2024-09-13 | デンカ株式会社 | 複合体及びその製造方法、並びに、積層体及びその製造方法 |
-
2023
- 2023-02-09 JP JP2023540575A patent/JP7374391B1/ja active Active
- 2023-02-09 WO PCT/JP2023/004440 patent/WO2023162705A1/ja not_active Ceased
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