JPWO2023162662A5 - - Google Patents

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Publication number
JPWO2023162662A5
JPWO2023162662A5 JP2024502983A JP2024502983A JPWO2023162662A5 JP WO2023162662 A5 JPWO2023162662 A5 JP WO2023162662A5 JP 2024502983 A JP2024502983 A JP 2024502983A JP 2024502983 A JP2024502983 A JP 2024502983A JP WO2023162662 A5 JPWO2023162662 A5 JP WO2023162662A5
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JP
Japan
Prior art keywords
metamaterial
pattern
conductor
less
conductive material
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Pending
Application number
JP2024502983A
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English (en)
Japanese (ja)
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JPWO2023162662A1 (https=
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Priority claimed from PCT/JP2023/003882 external-priority patent/WO2023162662A1/ja
Publication of JPWO2023162662A1 publication Critical patent/JPWO2023162662A1/ja
Publication of JPWO2023162662A5 publication Critical patent/JPWO2023162662A5/ja
Pending legal-status Critical Current

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JP2024502983A 2022-02-28 2023-02-06 Pending JPWO2023162662A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022030214 2022-02-28
PCT/JP2023/003882 WO2023162662A1 (ja) 2022-02-28 2023-02-06 メタマテリアル用基材、メタマテリアル、積層体及びメタマテリアルの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023162662A1 JPWO2023162662A1 (https=) 2023-08-31
JPWO2023162662A5 true JPWO2023162662A5 (https=) 2024-11-05

Family

ID=87765600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502983A Pending JPWO2023162662A1 (https=) 2022-02-28 2023-02-06

Country Status (3)

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US (1) US20240402569A1 (https=)
JP (1) JPWO2023162662A1 (https=)
WO (1) WO2023162662A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331589A (ja) * 2001-03-07 2002-11-19 Kuraray Co Ltd 金属張積層板の製造方法
JP4121402B2 (ja) * 2003-03-13 2008-07-23 株式会社クラレ 熱可塑性液晶ポリマーを用いた回路基板およびその製造方法
JP2006137011A (ja) * 2004-11-10 2006-06-01 Kuraray Co Ltd 金属張積層体およびその製造方法
US8648306B1 (en) * 2009-10-29 2014-02-11 Capco, Inc. Metamaterial dispersion
KR101729178B1 (ko) * 2011-06-28 2017-04-25 한국전자통신연구원 메타물질 능동소자 및 그의 제조방법
WO2015109359A1 (en) * 2014-01-24 2015-07-30 Rmit University Structured porous metamaterial
JP6719237B2 (ja) * 2016-03-18 2020-07-08 三井化学株式会社 メタマテリアルフィルム及びその製造方法
WO2018221500A1 (ja) * 2017-05-31 2018-12-06 パナソニックＩｐマネジメント株式会社 金属張積層板及びその製造方法
JP2019100837A (ja) * 2017-12-01 2019-06-24 日本電信電話株式会社 センシング装置
JP7509560B2 (ja) * 2020-03-31 2024-07-02 日鉄ケミカル＆マテリアル株式会社 樹脂フィルム、金属張積層板及び回路基板
JP7753238B2 (ja) * 2020-09-23 2025-10-14 デンカ株式会社 回路基板用絶縁材料及びその製造方法、並びに金属箔張積層板

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