JPWO2023157624A5 - - Google Patents
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- Publication number
- JPWO2023157624A5 JPWO2023157624A5 JP2024501072A JP2024501072A JPWO2023157624A5 JP WO2023157624 A5 JPWO2023157624 A5 JP WO2023157624A5 JP 2024501072 A JP2024501072 A JP 2024501072A JP 2024501072 A JP2024501072 A JP 2024501072A JP WO2023157624 A5 JPWO2023157624 A5 JP WO2023157624A5
- Authority
- JP
- Japan
- Prior art keywords
- layer structure
- interposer
- outer layer
- insulating resin
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 83
- 229920005989 resin Polymers 0.000 claims description 83
- 239000004065 semiconductor Substances 0.000 claims description 49
- 238000007689 inspection Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 4
- 238000000691 measurement method Methods 0.000 claims description 4
- 230000008439 repair process Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 claims description 2
- 238000013001 point bending Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 165
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022021044 | 2022-02-15 | ||
| JP2022188815 | 2022-11-28 | ||
| PCT/JP2023/002842 WO2023157624A1 (ja) | 2022-02-15 | 2023-01-30 | インターポーザ、半導体パッケージ及びそれらの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023157624A1 JPWO2023157624A1 (https=) | 2023-08-24 |
| JPWO2023157624A5 true JPWO2023157624A5 (https=) | 2025-04-22 |
Family
ID=87578489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024501072A Pending JPWO2023157624A1 (https=) | 2022-02-15 | 2023-01-30 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250029930A1 (https=) |
| JP (1) | JPWO2023157624A1 (https=) |
| KR (1) | KR20240155879A (https=) |
| TW (1) | TW202347639A (https=) |
| WO (1) | WO2023157624A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026058684A1 (ja) * | 2024-09-11 | 2026-03-19 | Ｔｏｐｐａｎホールディングス株式会社 | インターポーザ及び半導体パッケージ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4929784B2 (ja) * | 2006-03-27 | 2012-05-09 | 富士通株式会社 | 多層配線基板、半導体装置およびソルダレジスト |
| JP4832369B2 (ja) * | 2007-06-25 | 2011-12-07 | 富士通株式会社 | 回路基板、半導体装置、回路基板の製造方法、半導体装置の製造方法 |
| JP5079475B2 (ja) * | 2007-12-05 | 2012-11-21 | 新光電気工業株式会社 | 電子部品実装用パッケージ |
| JP5295596B2 (ja) * | 2008-03-19 | 2013-09-18 | 新光電気工業株式会社 | 多層配線基板およびその製造方法 |
| WO2013065287A1 (ja) | 2011-11-01 | 2013-05-10 | 住友ベークライト株式会社 | 半導体パッケージの製造方法 |
| JP2020088069A (ja) * | 2018-11-20 | 2020-06-04 | 凸版印刷株式会社 | 半導体パッケージ基板およびその製造方法 |
-
2023
- 2023-01-30 JP JP2024501072A patent/JPWO2023157624A1/ja active Pending
- 2023-01-30 WO PCT/JP2023/002842 patent/WO2023157624A1/ja not_active Ceased
- 2023-01-30 KR KR1020247030425A patent/KR20240155879A/ko active Pending
- 2023-02-14 TW TW112105122A patent/TW202347639A/zh unknown
-
2024
- 2024-08-14 US US18/805,153 patent/US20250029930A1/en active Pending
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