JPWO2023157210A1 - - Google Patents

Info

Publication number
JPWO2023157210A1
JPWO2023157210A1 JP2024500842A JP2024500842A JPWO2023157210A1 JP WO2023157210 A1 JPWO2023157210 A1 JP WO2023157210A1 JP 2024500842 A JP2024500842 A JP 2024500842A JP 2024500842 A JP2024500842 A JP 2024500842A JP WO2023157210 A1 JPWO2023157210 A1 JP WO2023157210A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024500842A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023157210A1 publication Critical patent/JPWO2023157210A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Die Bonding (AREA)
JP2024500842A 2022-02-18 2022-02-18 Pending JPWO2023157210A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/006540 WO2023157210A1 (ja) 2022-02-18 2022-02-18 素子実装体

Publications (1)

Publication Number Publication Date
JPWO2023157210A1 true JPWO2023157210A1 (ja) 2023-08-24

Family

ID=87577951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024500842A Pending JPWO2023157210A1 (ja) 2022-02-18 2022-02-18

Country Status (2)

Country Link
JP (1) JPWO2023157210A1 (ja)
WO (1) WO2023157210A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927566A (ja) * 1995-07-12 1997-01-28 Tokuyama Corp サブマウントの製造方法
JP2003037324A (ja) * 2001-07-25 2003-02-07 Sony Corp 半導体レーザ・アレイ装置及びその作製方法
JP2006021344A (ja) * 2004-07-06 2006-01-26 Fuji Photo Film Co Ltd 光定着器
JP2007019087A (ja) * 2005-07-05 2007-01-25 Sharp Corp 半導体レーザ装置、その製造方法
JP2009050900A (ja) * 2007-08-28 2009-03-12 Toyota Motor Corp 粒子入りはんだ及びその製造方法
JP5473630B2 (ja) * 2010-01-23 2014-04-16 京セラ株式会社 記録ヘッドおよびこれを備える記録装置
JP5598845B2 (ja) * 2010-05-11 2014-10-01 古河電気工業株式会社 レーザモジュール
US10720751B2 (en) * 2017-09-27 2020-07-21 Advanced Semiconductor Engineering, Inc. Optical package structure, optical module, and method for manufacturing the same
WO2019102956A1 (ja) * 2017-11-24 2019-05-31 京セラ株式会社 発光素子搭載用基板およびアレイ基板、ならびに発光装置
JP2020021823A (ja) * 2018-07-31 2020-02-06 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
WO2023157210A1 (ja) 2023-08-24

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Legal Events

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Effective date: 20231221