JPWO2023152908A1 - - Google Patents

Info

Publication number
JPWO2023152908A1
JPWO2023152908A1 JP2023579985A JP2023579985A JPWO2023152908A1 JP WO2023152908 A1 JPWO2023152908 A1 JP WO2023152908A1 JP 2023579985 A JP2023579985 A JP 2023579985A JP 2023579985 A JP2023579985 A JP 2023579985A JP WO2023152908 A1 JPWO2023152908 A1 JP WO2023152908A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023579985A
Other languages
Japanese (ja)
Other versions
JPWO2023152908A5 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023152908A1 publication Critical patent/JPWO2023152908A1/ja
Publication of JPWO2023152908A5 publication Critical patent/JPWO2023152908A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Jigging Conveyors (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Screen Printers (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
JP2023579985A 2022-02-10 2022-02-10 Pending JPWO2023152908A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/005460 WO2023152908A1 (ja) 2022-02-10 2022-02-10 上下振動装置、上下振動方法、部品供給装置、部品供給方法、及び、スクリーン印刷装置

Publications (2)

Publication Number Publication Date
JPWO2023152908A1 true JPWO2023152908A1 (zh) 2023-08-17
JPWO2023152908A5 JPWO2023152908A5 (zh) 2024-04-15

Family

ID=87563956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023579985A Pending JPWO2023152908A1 (zh) 2022-02-10 2022-02-10

Country Status (5)

Country Link
JP (1) JPWO2023152908A1 (zh)
KR (1) KR20240070591A (zh)
CN (1) CN117999859A (zh)
TW (1) TW202332593A (zh)
WO (1) WO2023152908A1 (zh)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2657356B2 (ja) 1993-10-06 1997-09-24 新日本製鐵株式会社 バンプの形成方法および形成装置
JPH0878829A (ja) * 1994-09-09 1996-03-22 Hitachi Ltd 表面実装プリント板のはんだ供給方法
JP3586334B2 (ja) 1996-04-05 2004-11-10 新日本製鐵株式会社 ボール跳躍装置
JP2000243872A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体装置及びその製造方法
JP4439708B2 (ja) * 2000-10-10 2010-03-24 新日鉄マテリアルズ株式会社 導電性ボールの吸引配列方法及び吸引配列装置
JP2003273161A (ja) * 2002-03-13 2003-09-26 Sekisui Chem Co Ltd 導電性粒子配置フィルムの製造装置
JP2010067893A (ja) * 2008-09-12 2010-03-25 Athlete Fa Kk ボール搭載装置
JP5202353B2 (ja) * 2009-01-21 2013-06-05 新光電気工業株式会社 導電性ボール搭載方法及び装置
JP7167944B2 (ja) 2017-12-26 2022-11-09 日本電産リード株式会社 搬送装置
KR102406310B1 (ko) * 2018-10-31 2022-06-13 마이크로·텍 가부시끼가이샤 바이브레이션 장치, 바이브레이션 방법 및 진동 투입 장치

Also Published As

Publication number Publication date
WO2023152908A1 (ja) 2023-08-17
KR20240070591A (ko) 2024-05-21
TW202332593A (zh) 2023-08-16
CN117999859A (zh) 2024-05-07

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240116

A621 Written request for application examination

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Effective date: 20240116