JPWO2023135624A1 - - Google Patents
Info
- Publication number
- JPWO2023135624A1 JPWO2023135624A1 JP2023553949A JP2023553949A JPWO2023135624A1 JP WO2023135624 A1 JPWO2023135624 A1 JP WO2023135624A1 JP 2023553949 A JP2023553949 A JP 2023553949A JP 2023553949 A JP2023553949 A JP 2023553949A JP WO2023135624 A1 JPWO2023135624 A1 JP WO2023135624A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2022/000461 WO2023135624A1 (ja) | 2022-01-11 | 2022-01-11 | 半導体部品分離装置並びにこれを用いた半導体部品分離及び取付方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2023135624A1 true JPWO2023135624A1 (ja) | 2023-07-20 |
JPWO2023135624A5 JPWO2023135624A5 (ja) | 2023-12-13 |
JP7451001B2 JP7451001B2 (ja) | 2024-03-18 |
Family
ID=87278578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023553949A Active JP7451001B2 (ja) | 2022-01-11 | 2022-01-11 | 半導体部品分離装置並びにこれを用いた半導体部品分離及び取付方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7451001B2 (ja) |
WO (1) | WO2023135624A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4989528B2 (ja) * | 2008-03-11 | 2012-08-01 | パナソニック株式会社 | 表面実装デバイスの実装構造体、そのリペア方法およびプリント基板 |
JP2011211073A (ja) * | 2010-03-30 | 2011-10-20 | Fujitsu Ltd | 電子部品のリペア装置、リペア方法、およびリペア用伝熱キャップ部材 |
JP7472472B2 (ja) * | 2019-11-15 | 2024-04-23 | 三菱電機株式会社 | リワーク条件学習装置、リワーク条件決定装置及びリワーク装置 |
-
2022
- 2022-01-11 JP JP2023553949A patent/JP7451001B2/ja active Active
- 2022-01-11 WO PCT/JP2022/000461 patent/WO2023135624A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP7451001B2 (ja) | 2024-03-18 |
WO2023135624A1 (ja) | 2023-07-20 |
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