JPWO2023181210A1 - - Google Patents

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Publication number
JPWO2023181210A1
JPWO2023181210A1 JP2023541088A JP2023541088A JPWO2023181210A1 JP WO2023181210 A1 JPWO2023181210 A1 JP WO2023181210A1 JP 2023541088 A JP2023541088 A JP 2023541088A JP 2023541088 A JP2023541088 A JP 2023541088A JP WO2023181210 A1 JPWO2023181210 A1 JP WO2023181210A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023541088A
Other versions
JP7438466B1 (ja
JPWO2023181210A5 (ja
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Publication of JP7438466B1 publication Critical patent/JP7438466B1/ja
Publication of JPWO2023181210A5 publication Critical patent/JPWO2023181210A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2023541088A 2022-03-23 2022-03-23 半導体装置及びその製造方法並びに電力変換装置 Active JP7438466B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/013670 WO2023181210A1 (ja) 2022-03-23 2022-03-23 半導体装置及びその製造方法並びに電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2023181210A1 true JPWO2023181210A1 (ja) 2023-09-28
JP7438466B1 JP7438466B1 (ja) 2024-02-26
JPWO2023181210A5 JPWO2023181210A5 (ja) 2024-03-01

Family

ID=88100567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023541088A Active JP7438466B1 (ja) 2022-03-23 2022-03-23 半導体装置及びその製造方法並びに電力変換装置

Country Status (2)

Country Link
JP (1) JP7438466B1 (ja)
WO (1) WO2023181210A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3262657B2 (ja) * 1993-12-14 2002-03-04 株式会社日立製作所 ボンディング方法及びボンディング構造
US20200273716A1 (en) * 2017-07-07 2020-08-27 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device
JP7383881B2 (ja) * 2019-01-16 2023-11-21 富士電機株式会社 半導体装置および半導体装置の製造方法
DE102019111963A1 (de) * 2019-05-08 2020-11-12 Danfoss Silicon Power Gmbh Halbleitermodul mit einem Halbleiter und mit einem Metallformteil, der vom Halbleiter elektrisch kontaktiert wird
CN116134593A (zh) * 2020-08-03 2023-05-16 三菱电机株式会社 半导体装置、半导体装置的制造方法以及电力变换装置

Also Published As

Publication number Publication date
JP7438466B1 (ja) 2024-02-26
WO2023181210A1 (ja) 2023-09-28

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