JPWO2023132319A1 - - Google Patents

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Publication number
JPWO2023132319A1
JPWO2023132319A1 JP2023572466A JP2023572466A JPWO2023132319A1 JP WO2023132319 A1 JPWO2023132319 A1 JP WO2023132319A1 JP 2023572466 A JP2023572466 A JP 2023572466A JP 2023572466 A JP2023572466 A JP 2023572466A JP WO2023132319 A1 JPWO2023132319 A1 JP WO2023132319A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023572466A
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Japanese (ja)
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JPWO2023132319A5 (https=
JP7808132B2 (ja
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Publication of JPWO2023132319A5 publication Critical patent/JPWO2023132319A5/ja
Application granted granted Critical
Publication of JP7808132B2 publication Critical patent/JP7808132B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2615—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen the other compounds containing carboxylic acid, ester or anhydride groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2023572466A 2022-01-04 2022-12-28 重合体、架橋体、電線、ワイヤーハーネス、重合体の製造方法、および架橋体の製造方法 Active JP7808132B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022000250 2022-01-04
JP2022000250 2022-01-04
PCT/JP2022/048525 WO2023132319A1 (ja) 2022-01-04 2022-12-28 重合体、架橋体、電線、ワイヤーハーネス、重合体の製造方法、および架橋体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023132319A1 true JPWO2023132319A1 (https=) 2023-07-13
JPWO2023132319A5 JPWO2023132319A5 (https=) 2024-08-27
JP7808132B2 JP7808132B2 (ja) 2026-01-28

Family

ID=87073739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572466A Active JP7808132B2 (ja) 2022-01-04 2022-12-28 重合体、架橋体、電線、ワイヤーハーネス、重合体の製造方法、および架橋体の製造方法

Country Status (5)

Country Link
US (1) US20250197556A1 (https=)
JP (1) JP7808132B2 (https=)
CN (1) CN118451129A (https=)
DE (1) DE112022005064T5 (https=)
WO (1) WO2023132319A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115426A (ja) * 1989-08-03 1991-05-16 General Electric Co <Ge> 硬化可能な誘電性ポリフェニレンエーテル‐ポリエポキシド組成物
JPH04132730A (ja) * 1990-01-02 1992-05-07 General Electric Co <Ge> 硬化可能なポリフェニレンエ―テル‐ポリエポキシド組成物
JPH06313097A (ja) * 1993-04-30 1994-11-08 Teijin Ltd ポリエステル樹脂組成物
JPH11115025A (ja) * 1997-07-28 1999-04-27 Sekisui Jushi Co Ltd バンド状物およびその製造方法
JPH11171975A (ja) * 1997-12-12 1999-06-29 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物
WO2006022278A1 (ja) * 2004-08-25 2006-03-02 Nagase Chemtex Corporation 重合性組成物
JP2007308521A (ja) * 2006-05-16 2007-11-29 Toagosei Co Ltd 熱可塑性樹脂組成物
JP2011179101A (ja) * 2010-03-04 2011-09-15 Autonetworks Technologies Ltd 防食剤、端子付き被覆電線およびワイヤーハーネス
JP2018090660A (ja) * 2016-11-30 2018-06-14 株式会社オートネットワーク技術研究所 硬化性組成物、硬化物および端子付き被覆電線
JP2021158176A (ja) * 2020-03-26 2021-10-07 住友ベークライト株式会社 電子装置および封止用樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6433762B2 (ja) 2014-11-07 2018-12-05 旭化成株式会社 電線被覆向け複合材料用エポキシ樹脂組成物

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115426A (ja) * 1989-08-03 1991-05-16 General Electric Co <Ge> 硬化可能な誘電性ポリフェニレンエーテル‐ポリエポキシド組成物
JPH04132730A (ja) * 1990-01-02 1992-05-07 General Electric Co <Ge> 硬化可能なポリフェニレンエ―テル‐ポリエポキシド組成物
JPH06313097A (ja) * 1993-04-30 1994-11-08 Teijin Ltd ポリエステル樹脂組成物
JPH11115025A (ja) * 1997-07-28 1999-04-27 Sekisui Jushi Co Ltd バンド状物およびその製造方法
JPH11171975A (ja) * 1997-12-12 1999-06-29 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物
WO2006022278A1 (ja) * 2004-08-25 2006-03-02 Nagase Chemtex Corporation 重合性組成物
JP2007308521A (ja) * 2006-05-16 2007-11-29 Toagosei Co Ltd 熱可塑性樹脂組成物
JP2011179101A (ja) * 2010-03-04 2011-09-15 Autonetworks Technologies Ltd 防食剤、端子付き被覆電線およびワイヤーハーネス
JP2018090660A (ja) * 2016-11-30 2018-06-14 株式会社オートネットワーク技術研究所 硬化性組成物、硬化物および端子付き被覆電線
JP2021158176A (ja) * 2020-03-26 2021-10-07 住友ベークライト株式会社 電子装置および封止用樹脂組成物

Also Published As

Publication number Publication date
US20250197556A1 (en) 2025-06-19
CN118451129A (zh) 2024-08-06
WO2023132319A1 (ja) 2023-07-13
DE112022005064T5 (de) 2024-08-01
JP7808132B2 (ja) 2026-01-28

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