JPWO2023120314A5 - - Google Patents

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Publication number
JPWO2023120314A5
JPWO2023120314A5 JP2023569341A JP2023569341A JPWO2023120314A5 JP WO2023120314 A5 JPWO2023120314 A5 JP WO2023120314A5 JP 2023569341 A JP2023569341 A JP 2023569341A JP 2023569341 A JP2023569341 A JP 2023569341A JP WO2023120314 A5 JPWO2023120314 A5 JP WO2023120314A5
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JP
Japan
Prior art keywords
resin
film
cured product
resin composition
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023569341A
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English (en)
Japanese (ja)
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JPWO2023120314A1 (https=
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Priority claimed from PCT/JP2022/046014 external-priority patent/WO2023120314A1/ja
Publication of JPWO2023120314A1 publication Critical patent/JPWO2023120314A1/ja
Publication of JPWO2023120314A5 publication Critical patent/JPWO2023120314A5/ja
Pending legal-status Critical Current

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JP2023569341A 2021-12-21 2022-12-14 Pending JPWO2023120314A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021206759 2021-12-21
PCT/JP2022/046014 WO2023120314A1 (ja) 2021-12-21 2022-12-14 積層体、デバイス、樹脂組成物、硬化物の製造方法、積層体の製造方法、及び、デバイスの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023120314A1 JPWO2023120314A1 (https=) 2023-06-29
JPWO2023120314A5 true JPWO2023120314A5 (https=) 2024-09-05

Family

ID=86902427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023569341A Pending JPWO2023120314A1 (https=) 2021-12-21 2022-12-14

Country Status (4)

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JP (1) JPWO2023120314A1 (https=)
KR (1) KR20240110029A (https=)
TW (1) TW202335837A (https=)
WO (1) WO2023120314A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI893463B (zh) * 2023-09-27 2025-08-11 奇美實業股份有限公司 絕緣電線及其製造方法、線圈以及電子機器
WO2026029152A1 (ja) * 2024-08-01 2026-02-05 旭化成株式会社 ネガ型感光性樹脂組成物、それを用いた硬化膜、硬化レリーフパターンの製造方法、及び半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254014A (ja) * 2000-01-05 2001-09-18 Toray Ind Inc 感光性ポリイミド前駆体組成物および金属箔−ポリイミド複合体
US7348045B2 (en) * 2002-09-05 2008-03-25 3M Innovative Properties Company Controlled depth etched dielectric film
JP2011225756A (ja) * 2010-04-21 2011-11-10 Kao Corp 低誘電樹脂組成物
JP6576113B2 (ja) * 2014-06-17 2019-09-18 東邦化成株式会社 フッ素樹脂含有水性ポリイミド前駆体組成物及びそれを用いた積層体とプリント配線基板、並びにその積層体の製造方法
JP6491947B2 (ja) 2015-05-08 2019-03-27 三菱鉛筆株式会社 フッ素系樹脂含有ポリイミド前駆体溶液組成物、それを用いたポリイミド、ポリイミドフィルム、およびそれらの製造方法
KR102090451B1 (ko) 2015-08-21 2020-03-18 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치

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