JPWO2023080082A5 - - Google Patents

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Publication number
JPWO2023080082A5
JPWO2023080082A5 JP2023558007A JP2023558007A JPWO2023080082A5 JP WO2023080082 A5 JPWO2023080082 A5 JP WO2023080082A5 JP 2023558007 A JP2023558007 A JP 2023558007A JP 2023558007 A JP2023558007 A JP 2023558007A JP WO2023080082 A5 JPWO2023080082 A5 JP WO2023080082A5
Authority
JP
Japan
Prior art keywords
layer
semiconductor device
terminal
main surface
sealing insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023558007A
Other languages
English (en)
Japanese (ja)
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JPWO2023080082A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/040494 external-priority patent/WO2023080082A1/ja
Publication of JPWO2023080082A1 publication Critical patent/JPWO2023080082A1/ja
Publication of JPWO2023080082A5 publication Critical patent/JPWO2023080082A5/ja
Pending legal-status Critical Current

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JP2023558007A 2021-11-05 2022-10-28 Pending JPWO2023080082A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021181313 2021-11-05
PCT/JP2022/040494 WO2023080082A1 (ja) 2021-11-05 2022-10-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023080082A1 JPWO2023080082A1 (cg-RX-API-DMAC7.html) 2023-05-11
JPWO2023080082A5 true JPWO2023080082A5 (cg-RX-API-DMAC7.html) 2024-07-24

Family

ID=86241093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023558007A Pending JPWO2023080082A1 (cg-RX-API-DMAC7.html) 2021-11-05 2022-10-28

Country Status (5)

Country Link
US (1) US20240290679A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023080082A1 (cg-RX-API-DMAC7.html)
CN (1) CN118176590A (cg-RX-API-DMAC7.html)
DE (1) DE112022004867T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023080082A1 (cg-RX-API-DMAC7.html)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3945929B2 (ja) * 1999-01-29 2007-07-18 三洋電機株式会社 半導体装置の製造方法
JP2009188148A (ja) * 2008-02-06 2009-08-20 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP2013239607A (ja) * 2012-05-16 2013-11-28 Mitsubishi Electric Corp 半導体装置
DE112015006450T5 (de) * 2015-04-14 2017-12-28 Mitsubishi Electric Corporation Halbleitereinheit
CN113016067B (zh) * 2018-11-15 2024-02-02 罗姆股份有限公司 半导体器件
JP7248138B2 (ja) * 2019-10-03 2023-03-29 三菱電機株式会社 半導体装置および電力変換装置
JP7083370B2 (ja) 2020-05-18 2022-06-10 合同会社箱一 コンテナにおける扉の開閉機構およびそれを備えるコンテナ
US20230335633A1 (en) * 2021-03-18 2023-10-19 Rohm Co., Ltd. Wide bandgap semiconductor device

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