JPWO2023080014A1 - - Google Patents
Info
- Publication number
- JPWO2023080014A1 JPWO2023080014A1 JP2023557962A JP2023557962A JPWO2023080014A1 JP WO2023080014 A1 JPWO2023080014 A1 JP WO2023080014A1 JP 2023557962 A JP2023557962 A JP 2023557962A JP 2023557962 A JP2023557962 A JP 2023557962A JP WO2023080014 A1 JPWO2023080014 A1 JP WO2023080014A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021180049 | 2021-11-04 | ||
| PCT/JP2022/039682 WO2023080014A1 (ja) | 2021-11-04 | 2022-10-25 | 研磨剤、添加液および研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080014A1 true JPWO2023080014A1 (https=) | 2023-05-11 |
| JPWO2023080014A5 JPWO2023080014A5 (https=) | 2024-11-11 |
Family
ID=86240948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557962A Pending JPWO2023080014A1 (https=) | 2021-11-04 | 2022-10-25 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023080014A1 (https=) |
| TW (1) | TW202334342A (https=) |
| WO (1) | WO2023080014A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3495143B2 (ja) * | 1995-07-04 | 2004-02-09 | 富士通株式会社 | 研磨剤、研磨方法および半導体装置の製造方法 |
| JP2003059868A (ja) * | 2001-08-10 | 2003-02-28 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| US6589100B2 (en) * | 2001-09-24 | 2003-07-08 | Cabot Microelectronics Corporation | Rare earth salt/oxidizer-based CMP method |
| WO2018179062A1 (ja) * | 2017-03-27 | 2018-10-04 | 日立化成株式会社 | 研磨液、研磨液セット、添加液及び研磨方法 |
| JP7493367B2 (ja) * | 2020-03-27 | 2024-05-31 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法および半導体基板の製造方法 |
-
2022
- 2022-10-25 WO PCT/JP2022/039682 patent/WO2023080014A1/ja not_active Ceased
- 2022-10-25 JP JP2023557962A patent/JPWO2023080014A1/ja active Pending
- 2022-10-27 TW TW111140826A patent/TW202334342A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023080014A1 (ja) | 2023-05-11 |
| TW202334342A (zh) | 2023-09-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241031 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250806 |