JPWO2023074739A1 - - Google Patents
Info
- Publication number
- JPWO2023074739A1 JPWO2023074739A1 JP2023556599A JP2023556599A JPWO2023074739A1 JP WO2023074739 A1 JPWO2023074739 A1 JP WO2023074739A1 JP 2023556599 A JP2023556599 A JP 2023556599A JP 2023556599 A JP2023556599 A JP 2023556599A JP WO2023074739 A1 JPWO2023074739 A1 JP WO2023074739A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021178070 | 2021-10-29 | ||
PCT/JP2022/039937 WO2023074739A1 (ja) | 2021-10-29 | 2022-10-26 | セラミック焼結体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023074739A1 true JPWO2023074739A1 (enrdf_load_stackoverflow) | 2023-05-04 |
JPWO2023074739A5 JPWO2023074739A5 (enrdf_load_stackoverflow) | 2024-09-09 |
Family
ID=86158011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023556599A Pending JPWO2023074739A1 (enrdf_load_stackoverflow) | 2021-10-29 | 2022-10-26 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023074739A1 (enrdf_load_stackoverflow) |
TW (1) | TW202334065A (enrdf_load_stackoverflow) |
WO (1) | WO2023074739A1 (enrdf_load_stackoverflow) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3310469B2 (ja) * | 1994-08-05 | 2002-08-05 | 株式会社日立製作所 | セラミック電子回路基板の焼成装置および焼成方法 |
JP2001089248A (ja) * | 1999-09-22 | 2001-04-03 | Ngk Spark Plug Co Ltd | セラミック基板の製造方法及びそれに使用する冶具 |
JP2002226279A (ja) * | 2001-01-31 | 2002-08-14 | Ngk Spark Plug Co Ltd | シート焼結体の製造方法 |
JP4599783B2 (ja) * | 2001-09-20 | 2010-12-15 | 株式会社村田製作所 | 低温焼成セラミック回路基板の製造方法 |
JP2009143730A (ja) * | 2007-12-11 | 2009-07-02 | Tokuyama Corp | 板状セラミックス成形体の焼成方法および板状セラミックス成形体 |
-
2022
- 2022-10-26 WO PCT/JP2022/039937 patent/WO2023074739A1/ja active Application Filing
- 2022-10-26 JP JP2023556599A patent/JPWO2023074739A1/ja active Pending
- 2022-10-28 TW TW111141067A patent/TW202334065A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202334065A (zh) | 2023-09-01 |
WO2023074739A1 (ja) | 2023-05-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20231201 |