JPWO2023074342A1 - - Google Patents

Info

Publication number
JPWO2023074342A1
JPWO2023074342A1 JP2023556280A JP2023556280A JPWO2023074342A1 JP WO2023074342 A1 JPWO2023074342 A1 JP WO2023074342A1 JP 2023556280 A JP2023556280 A JP 2023556280A JP 2023556280 A JP2023556280 A JP 2023556280A JP WO2023074342 A1 JPWO2023074342 A1 JP WO2023074342A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023556280A
Other versions
JPWO2023074342A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023074342A1 publication Critical patent/JPWO2023074342A1/ja
Publication of JPWO2023074342A5 publication Critical patent/JPWO2023074342A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2023556280A 2021-10-25 2022-10-11 Pending JPWO2023074342A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021174038 2021-10-25
PCT/JP2022/037801 WO2023074342A1 (ja) 2021-10-25 2022-10-11 電子素子実装用基板、電子装置、および電子モジュール

Publications (2)

Publication Number Publication Date
JPWO2023074342A1 true JPWO2023074342A1 (ja) 2023-05-04
JPWO2023074342A5 JPWO2023074342A5 (ja) 2024-07-10

Family

ID=86159291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556280A Pending JPWO2023074342A1 (ja) 2021-10-25 2022-10-11

Country Status (3)

Country Link
JP (1) JPWO2023074342A1 (ja)
CN (1) CN118251763A (ja)
WO (1) WO2023074342A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344008A (ja) * 2001-05-17 2002-11-29 Fuji Xerox Co Ltd 光素子モジュール
JP2005101366A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 高周波モジュール
JP6034158B2 (ja) * 2012-11-29 2016-11-30 京セラ株式会社 配線基板およびそれを用いた実装構造体
US9496247B2 (en) * 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
JP2017198950A (ja) * 2016-04-28 2017-11-02 APRESIA Systems株式会社 光通信モジュール
JP6305668B1 (ja) * 2016-08-10 2018-04-04 京セラ株式会社 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置
JP2020155622A (ja) 2019-03-20 2020-09-24 富士ゼロックス株式会社 発光装置、光学装置および情報処理装置
JP7411350B2 (ja) * 2019-08-20 2024-01-11 ソニーセミコンダクタソリューションズ株式会社 測距装置、電子機器、および、測距装置の製造方法
JP7432387B2 (ja) * 2020-02-18 2024-02-16 株式会社Lixil 給水装置

Also Published As

Publication number Publication date
CN118251763A (zh) 2024-06-25
WO2023074342A1 (ja) 2023-05-04

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

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Effective date: 20240423

A621 Written request for application examination

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Effective date: 20240423