JPWO2023074342A1 - - Google Patents
Info
- Publication number
- JPWO2023074342A1 JPWO2023074342A1 JP2023556280A JP2023556280A JPWO2023074342A1 JP WO2023074342 A1 JPWO2023074342 A1 JP WO2023074342A1 JP 2023556280 A JP2023556280 A JP 2023556280A JP 2023556280 A JP2023556280 A JP 2023556280A JP WO2023074342 A1 JPWO2023074342 A1 JP WO2023074342A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021174038 | 2021-10-25 | ||
PCT/JP2022/037801 WO2023074342A1 (ja) | 2021-10-25 | 2022-10-11 | 電子素子実装用基板、電子装置、および電子モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023074342A1 true JPWO2023074342A1 (ja) | 2023-05-04 |
JPWO2023074342A5 JPWO2023074342A5 (ja) | 2024-07-10 |
Family
ID=86159291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023556280A Pending JPWO2023074342A1 (ja) | 2021-10-25 | 2022-10-11 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023074342A1 (ja) |
CN (1) | CN118251763A (ja) |
WO (1) | WO2023074342A1 (ja) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002344008A (ja) * | 2001-05-17 | 2002-11-29 | Fuji Xerox Co Ltd | 光素子モジュール |
JP2005101366A (ja) * | 2003-09-25 | 2005-04-14 | Kyocera Corp | 高周波モジュール |
JP6034158B2 (ja) * | 2012-11-29 | 2016-11-30 | 京セラ株式会社 | 配線基板およびそれを用いた実装構造体 |
US9496247B2 (en) * | 2013-08-26 | 2016-11-15 | Optiz, Inc. | Integrated camera module and method of making same |
JP2017198950A (ja) * | 2016-04-28 | 2017-11-02 | APRESIA Systems株式会社 | 光通信モジュール |
JP6305668B1 (ja) * | 2016-08-10 | 2018-04-04 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
JP2020155622A (ja) | 2019-03-20 | 2020-09-24 | 富士ゼロックス株式会社 | 発光装置、光学装置および情報処理装置 |
JP7411350B2 (ja) * | 2019-08-20 | 2024-01-11 | ソニーセミコンダクタソリューションズ株式会社 | 測距装置、電子機器、および、測距装置の製造方法 |
JP7432387B2 (ja) * | 2020-02-18 | 2024-02-16 | 株式会社Lixil | 給水装置 |
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2022
- 2022-10-11 JP JP2023556280A patent/JPWO2023074342A1/ja active Pending
- 2022-10-11 CN CN202280071217.4A patent/CN118251763A/zh active Pending
- 2022-10-11 WO PCT/JP2022/037801 patent/WO2023074342A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN118251763A (zh) | 2024-06-25 |
WO2023074342A1 (ja) | 2023-05-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240423 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240423 |