JPWO2023074174A1 - - Google Patents

Info

Publication number
JPWO2023074174A1
JPWO2023074174A1 JP2023556187A JP2023556187A JPWO2023074174A1 JP WO2023074174 A1 JPWO2023074174 A1 JP WO2023074174A1 JP 2023556187 A JP2023556187 A JP 2023556187A JP 2023556187 A JP2023556187 A JP 2023556187A JP WO2023074174 A1 JPWO2023074174 A1 JP WO2023074174A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023556187A
Other languages
Japanese (ja)
Other versions
JPWO2023074174A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023074174A1 publication Critical patent/JPWO2023074174A1/ja
Publication of JPWO2023074174A5 publication Critical patent/JPWO2023074174A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2904Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926Crystal orientations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3408Silicon carbide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2023556187A 2021-11-01 2022-09-15 Pending JPWO2023074174A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021178510 2021-11-01
PCT/JP2022/034583 WO2023074174A1 (ja) 2021-11-01 2022-09-15 炭化珪素基板および炭化珪素基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023074174A1 true JPWO2023074174A1 (https=) 2023-05-04
JPWO2023074174A5 JPWO2023074174A5 (https=) 2024-07-18

Family

ID=86157853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556187A Pending JPWO2023074174A1 (https=) 2021-11-01 2022-09-15

Country Status (3)

Country Link
US (1) US20250006796A1 (https=)
JP (1) JPWO2023074174A1 (https=)
WO (1) WO2023074174A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025063054A1 (ja) * 2023-09-21 2025-03-27 住友電気工業株式会社 炭化珪素基板、炭化珪素エピタキシャル基板、炭化珪素半導体装置の製造方法、および炭化珪素結晶の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5406936B2 (ja) * 2008-12-08 2014-02-05 トゥー‐シックス・インコーポレイテッド 向上した軸勾配輸送(agt)成長方法、及び抵抗加熱を利用した装置
JP2011190154A (ja) * 2010-03-16 2011-09-29 Sumitomo Electric Ind Ltd 結晶の製造方法、結晶の製造装置および積層膜
JP6387895B2 (ja) * 2014-09-24 2018-09-12 住友電気工業株式会社 炭化珪素単結晶の製造方法
CN106119954B (zh) * 2016-08-31 2018-11-06 台州市一能科技有限公司 一种碳化硅单晶制造装置
JP2018043898A (ja) * 2016-09-13 2018-03-22 トヨタ自動車株式会社 SiC単結晶の製造方法
WO2021215120A1 (ja) * 2020-04-22 2021-10-28 住友電気工業株式会社 炭化珪素単結晶および炭化珪素単結晶の製造方法

Also Published As

Publication number Publication date
US20250006796A1 (en) 2025-01-02
WO2023074174A1 (ja) 2023-05-04

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