JPWO2023074174A1 - - Google Patents
Info
- Publication number
- JPWO2023074174A1 JPWO2023074174A1 JP2023556187A JP2023556187A JPWO2023074174A1 JP WO2023074174 A1 JPWO2023074174 A1 JP WO2023074174A1 JP 2023556187 A JP2023556187 A JP 2023556187A JP 2023556187 A JP2023556187 A JP 2023556187A JP WO2023074174 A1 JPWO2023074174 A1 JP WO2023074174A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2904—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3408—Silicon carbide
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021178510 | 2021-11-01 | ||
| PCT/JP2022/034583 WO2023074174A1 (ja) | 2021-11-01 | 2022-09-15 | 炭化珪素基板および炭化珪素基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023074174A1 true JPWO2023074174A1 (https=) | 2023-05-04 |
| JPWO2023074174A5 JPWO2023074174A5 (https=) | 2024-07-18 |
Family
ID=86157853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556187A Pending JPWO2023074174A1 (https=) | 2021-11-01 | 2022-09-15 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250006796A1 (https=) |
| JP (1) | JPWO2023074174A1 (https=) |
| WO (1) | WO2023074174A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025063054A1 (ja) * | 2023-09-21 | 2025-03-27 | 住友電気工業株式会社 | 炭化珪素基板、炭化珪素エピタキシャル基板、炭化珪素半導体装置の製造方法、および炭化珪素結晶の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5406936B2 (ja) * | 2008-12-08 | 2014-02-05 | トゥー‐シックス・インコーポレイテッド | 向上した軸勾配輸送(agt)成長方法、及び抵抗加熱を利用した装置 |
| JP2011190154A (ja) * | 2010-03-16 | 2011-09-29 | Sumitomo Electric Ind Ltd | 結晶の製造方法、結晶の製造装置および積層膜 |
| JP6387895B2 (ja) * | 2014-09-24 | 2018-09-12 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
| CN106119954B (zh) * | 2016-08-31 | 2018-11-06 | 台州市一能科技有限公司 | 一种碳化硅单晶制造装置 |
| JP2018043898A (ja) * | 2016-09-13 | 2018-03-22 | トヨタ自動車株式会社 | SiC単結晶の製造方法 |
| WO2021215120A1 (ja) * | 2020-04-22 | 2021-10-28 | 住友電気工業株式会社 | 炭化珪素単結晶および炭化珪素単結晶の製造方法 |
-
2022
- 2022-09-15 JP JP2023556187A patent/JPWO2023074174A1/ja active Pending
- 2022-09-15 US US18/703,652 patent/US20250006796A1/en active Pending
- 2022-09-15 WO PCT/JP2022/034583 patent/WO2023074174A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20250006796A1 (en) | 2025-01-02 |
| WO2023074174A1 (ja) | 2023-05-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240411 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250725 |
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| A711 | Notification of change in applicant |
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