JPWO2023067900A1 - - Google Patents
Info
- Publication number
- JPWO2023067900A1 JPWO2023067900A1 JP2023554971A JP2023554971A JPWO2023067900A1 JP WO2023067900 A1 JPWO2023067900 A1 JP WO2023067900A1 JP 2023554971 A JP2023554971 A JP 2023554971A JP 2023554971 A JP2023554971 A JP 2023554971A JP WO2023067900 A1 JPWO2023067900 A1 JP WO2023067900A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021173431 | 2021-10-22 | ||
| JP2021173431 | 2021-10-22 | ||
| PCT/JP2022/032537 WO2023067900A1 (ja) | 2021-10-22 | 2022-08-30 | 透明導電圧電フィルム、タッチパネル、および透明導電圧電フィルムの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023067900A1 true JPWO2023067900A1 (https=) | 2023-04-27 |
| JPWO2023067900A5 JPWO2023067900A5 (https=) | 2024-05-08 |
| JP7624085B2 JP7624085B2 (ja) | 2025-01-29 |
Family
ID=86059019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023554971A Active JP7624085B2 (ja) | 2021-10-22 | 2022-08-30 | 透明導電圧電フィルム、タッチパネル、および透明導電圧電フィルムの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240415020A1 (https=) |
| EP (1) | EP4422381A4 (https=) |
| JP (1) | JP7624085B2 (https=) |
| KR (1) | KR102789950B1 (https=) |
| CN (1) | CN118044357A (https=) |
| TW (1) | TWI834329B (https=) |
| WO (1) | WO2023067900A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI888061B (zh) * | 2023-04-19 | 2025-06-21 | 日商吳羽股份有限公司 | 積層壓電體及其製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002120311A (ja) * | 2000-10-13 | 2002-04-23 | Jsr Corp | 構造体 |
| JP2004098420A (ja) * | 2002-09-09 | 2004-04-02 | Dainippon Printing Co Ltd | 透明積層フィルム、偏光板、液晶表示素子及び液晶表示装置 |
| JP2015186908A (ja) * | 2014-10-20 | 2015-10-29 | 三井化学株式会社 | 積層体 |
| JP2017074792A (ja) * | 2016-12-28 | 2017-04-20 | 日東電工株式会社 | 透明導電性フィルム及びタッチパネル |
| WO2017170616A1 (ja) * | 2016-03-28 | 2017-10-05 | ダイキン工業株式会社 | バイモルフ型圧電フィルム |
| JP2019096680A (ja) * | 2017-11-21 | 2019-06-20 | 日東電工株式会社 | 圧電フィルムおよび圧電センサ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6487178B2 (ja) * | 2014-10-20 | 2019-03-20 | 三井化学株式会社 | 積層体 |
| CN107251252B (zh) * | 2015-02-13 | 2019-11-29 | 三井化学株式会社 | 高分子压电膜及其制造方法 |
-
2022
- 2022-08-30 CN CN202280063610.9A patent/CN118044357A/zh active Pending
- 2022-08-30 US US18/702,044 patent/US20240415020A1/en active Pending
- 2022-08-30 WO PCT/JP2022/032537 patent/WO2023067900A1/ja not_active Ceased
- 2022-08-30 JP JP2023554971A patent/JP7624085B2/ja active Active
- 2022-08-30 EP EP22883212.7A patent/EP4422381A4/en active Pending
- 2022-08-30 KR KR1020247012556A patent/KR102789950B1/ko active Active
- 2022-10-06 TW TW111137941A patent/TWI834329B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002120311A (ja) * | 2000-10-13 | 2002-04-23 | Jsr Corp | 構造体 |
| JP2004098420A (ja) * | 2002-09-09 | 2004-04-02 | Dainippon Printing Co Ltd | 透明積層フィルム、偏光板、液晶表示素子及び液晶表示装置 |
| JP2015186908A (ja) * | 2014-10-20 | 2015-10-29 | 三井化学株式会社 | 積層体 |
| WO2017170616A1 (ja) * | 2016-03-28 | 2017-10-05 | ダイキン工業株式会社 | バイモルフ型圧電フィルム |
| JP2017074792A (ja) * | 2016-12-28 | 2017-04-20 | 日東電工株式会社 | 透明導電性フィルム及びタッチパネル |
| JP2019096680A (ja) * | 2017-11-21 | 2019-06-20 | 日東電工株式会社 | 圧電フィルムおよび圧電センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118044357A (zh) | 2024-05-14 |
| KR20240060822A (ko) | 2024-05-08 |
| TW202318448A (zh) | 2023-05-01 |
| US20240415020A1 (en) | 2024-12-12 |
| JP7624085B2 (ja) | 2025-01-29 |
| EP4422381A4 (en) | 2025-01-29 |
| EP4422381A1 (en) | 2024-08-28 |
| KR102789950B1 (ko) | 2025-04-01 |
| TWI834329B (zh) | 2024-03-01 |
| WO2023067900A1 (ja) | 2023-04-27 |
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