JPWO2023063046A1 - - Google Patents

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Publication number
JPWO2023063046A1
JPWO2023063046A1 JP2023532640A JP2023532640A JPWO2023063046A1 JP WO2023063046 A1 JPWO2023063046 A1 JP WO2023063046A1 JP 2023532640 A JP2023532640 A JP 2023532640A JP 2023532640 A JP2023532640 A JP 2023532640A JP WO2023063046 A1 JPWO2023063046 A1 JP WO2023063046A1
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JP
Japan
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JP2023532640A
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JP7533793B2 (ja
JPWO2023063046A5 (ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
JP2023532640A 2021-10-15 2022-09-22 窒化物半導体基板及びその製造方法 Active JP7533793B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021169808 2021-10-15
JP2021169808 2021-10-15
PCT/JP2022/035314 WO2023063046A1 (ja) 2021-10-15 2022-09-22 窒化物半導体基板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023063046A1 true JPWO2023063046A1 (ja) 2023-04-20
JPWO2023063046A5 JPWO2023063046A5 (ja) 2023-09-21
JP7533793B2 JP7533793B2 (ja) 2024-08-14

Family

ID=85987682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023532640A Active JP7533793B2 (ja) 2021-10-15 2022-09-22 窒化物半導体基板及びその製造方法

Country Status (3)

Country Link
JP (1) JP7533793B2 (ja)
TW (1) TW202336831A (ja)
WO (1) WO2023063046A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223330A (ja) * 1990-12-25 1992-08-13 Univ Nagoya 単結晶珪素基板上への化合物半導体単結晶の作製方法
JP2005203666A (ja) * 2004-01-19 2005-07-28 Kansai Electric Power Co Inc:The 化合物半導体デバイスの製造方法
JP2006196713A (ja) * 2005-01-13 2006-07-27 National Institute Of Advanced Industrial & Technology 半導体装置及びその作製方法並びに重水素処理装置
JP2012151401A (ja) * 2011-01-21 2012-08-09 Sumco Corp 半導体基板及びその製造方法
JP2013080776A (ja) * 2011-10-03 2013-05-02 Covalent Materials Corp 窒化物半導体基板
JP2014229872A (ja) * 2013-05-27 2014-12-08 シャープ株式会社 窒化物半導体エピタキシャルウェハ
JP2019523994A (ja) * 2016-06-14 2019-08-29 クロミス，インコーポレイテッド 電力およびｒｆ用途用の設計された基板構造
JP2020184616A (ja) * 2019-05-03 2020-11-12 世界先進積體電路股▲ふん▼有限公司 基板およびその形成方法
WO2022181163A1 (ja) * 2021-02-26 2022-09-01 信越半導体株式会社 窒化物半導体基板およびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223330A (ja) * 1990-12-25 1992-08-13 Univ Nagoya 単結晶珪素基板上への化合物半導体単結晶の作製方法
JP2005203666A (ja) * 2004-01-19 2005-07-28 Kansai Electric Power Co Inc:The 化合物半導体デバイスの製造方法
JP2006196713A (ja) * 2005-01-13 2006-07-27 National Institute Of Advanced Industrial & Technology 半導体装置及びその作製方法並びに重水素処理装置
JP2012151401A (ja) * 2011-01-21 2012-08-09 Sumco Corp 半導体基板及びその製造方法
JP2013080776A (ja) * 2011-10-03 2013-05-02 Covalent Materials Corp 窒化物半導体基板
JP2014229872A (ja) * 2013-05-27 2014-12-08 シャープ株式会社 窒化物半導体エピタキシャルウェハ
JP2019523994A (ja) * 2016-06-14 2019-08-29 クロミス，インコーポレイテッド 電力およびｒｆ用途用の設計された基板構造
JP2020184616A (ja) * 2019-05-03 2020-11-12 世界先進積體電路股▲ふん▼有限公司 基板およびその形成方法
WO2022181163A1 (ja) * 2021-02-26 2022-09-01 信越半導体株式会社 窒化物半導体基板およびその製造方法

Also Published As

Publication number Publication date
TW202336831A (zh) 2023-09-16
JP7533793B2 (ja) 2024-08-14
WO2023063046A1 (ja) 2023-04-20

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