JPWO2023054031A5 - - Google Patents

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JPWO2023054031A5
JPWO2023054031A5 JP2023511868A JP2023511868A JPWO2023054031A5 JP WO2023054031 A5 JPWO2023054031 A5 JP WO2023054031A5 JP 2023511868 A JP2023511868 A JP 2023511868A JP 2023511868 A JP2023511868 A JP 2023511868A JP WO2023054031 A5 JPWO2023054031 A5 JP WO2023054031A5
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plate
resin
filled
cured
semi
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JP2023511868A
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JPWO2023054031A1 (en
JP7381806B2 (en
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Priority claimed from PCT/JP2022/034810 external-priority patent/WO2023054031A1/en
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Claims (12)

金属板と、前記金属板上に設けられた樹脂充填板と、前記樹脂充填板上に設けられた半硬化樹脂層と、からなり、
前記樹脂充填板は、多孔質の窒化物焼結板と、前記窒化物焼結板の気孔に充填された硬化樹脂と、を含み、
前記半硬化樹脂層は熱硬化性樹脂を含有する、積層部品。 comprising a metal plate, a resin-filled plate provided on the metal plate , and a semi-cured resin layer provided on the resin-filled plate ,
The resin-filled plate includes a porous nitride sintered plate and a cured resin filled in the pores of the nitride sintered plate,
A laminated component, wherein the semi-cured resin layer contains a thermosetting resin. 前記半硬化樹脂層の厚さが６５μｍ以下である、請求項１に記載の積層部品。 2. The laminate component according to claim 1, wherein the semi-cured resin layer has a thickness of 65 [mu]m or less. 前記窒化物焼結板の厚さが１．０ｍｍ以下である、請求項１又は２に記載の積層部品。 3. The laminate component according to claim 1, wherein the nitride sintered plate has a thickness of 1.0 mm or less. 前記熱硬化性樹脂の硬化率が６０％以下である、請求項１又は２に記載の積層部品。 3. The laminate component according to claim 1, wherein the thermosetting resin has a cure rate of 60% or less. 前記硬化樹脂の硬化率が、前記熱硬化性樹脂の硬化率よりも大きい、請求項１又は２に記載の積層部品。 3. The laminate component according to claim 1 or 2, wherein the cure rate of the cured resin is greater than the cure rate of the thermosetting resin. 前記硬化樹脂の硬化率が９０％以上である、請求項１又は２に記載の積層部品。 3. The laminate component according to claim 1, wherein the cured resin has a cure rate of 90% or more. 金属板と、前記金属板上に設けられた樹脂充填板と、からなり、
前記樹脂充填板は、多孔質の窒化物焼結板と、前記窒化物焼結板の気孔に充填された硬化樹脂と、を含む、積層体。 Consisting of a metal plate and a resin-filled plate provided on the metal plate ,
The laminated body, wherein the resin-filled plate includes a porous nitride sintered plate and a cured resin filled in the pores of the nitride sintered plate. 前記硬化樹脂の硬化率が９０％以上である、請求項７に記載の積層体。 The laminate according to claim 7, wherein the cured resin has a curing rate of 90% or more. 多孔質の窒化物焼結板と、前記窒化物焼結板の気孔に充填された熱硬化性樹脂組成物の半硬化物とを含む樹脂含浸体を、金属板上に配置し、前記半硬化物を加熱することによって、前記窒化物焼結板の気孔に充填された硬化樹脂を含む樹脂充填板と、前記金属板とを備える積層体を調製する第一工程と、
前記樹脂充填板の前記金属板側とは反対側に、熱硬化性樹脂を含有する半硬化樹脂層を設ける第二工程と、を有する、積層部品の製造方法。 A resin-impregnated body containing a porous nitride sintered plate and a semi-cured thermosetting resin composition filled in the pores of the nitride sintered plate is placed on a metal plate, and the semi-cured a first step of preparing a laminate comprising a resin-filled plate containing a cured resin filled in the pores of the nitride sintered plate and the metal plate by heating the material;
and a second step of providing a semi-cured resin layer containing a thermosetting resin on the side of the resin-filled plate opposite to the metal plate side. 前記第二工程が、支持体と、前記支持体上に設けられた半硬化樹脂層とを備える積層フィルムを用意し、前記積層フィルムの前記半硬化樹脂層を前記樹脂充填板の前記金属板側とは反対側に転写して、半硬化樹脂層を設ける工程である、請求項９に記載の製造方法。 In the second step, a laminated film comprising a support and a semi-cured resin layer provided on the support is prepared, and the semi-cured resin layer of the laminated film is placed on the metal plate side of the resin-filled plate. 10. The manufacturing method according to claim 9, wherein the step of transferring to the opposite side to provide a semi-cured resin layer. 多孔質の窒化物焼結板と、前記窒化物焼結板の気孔に充填された熱硬化性樹脂組成物の半硬化物とを含む樹脂含浸体を、金属板上に配置し、前記半硬化物を加熱することによって、前記窒化物焼結板の気孔に充填された硬化樹脂を含む樹脂充填板と、前記金属板とを備える積層体を調製する工程を、有する、積層体の製造方法。 A resin-impregnated body containing a porous nitride sintered plate and a semi-cured thermosetting resin composition filled in the pores of the nitride sintered plate is placed on a metal plate, and the semi-cured A method for producing a laminate, comprising a step of preparing a laminate comprising a resin-filled plate containing a cured resin filled in pores of the nitride sintered plate and the metal plate by heating an object. 前記硬化樹脂の硬化率が９０％以上である、請求項１１に記載の製造方法。 12. The manufacturing method according to claim 11, wherein the curing rate of the cured resin is 90% or more.
JP2023511868A 2021-09-28 2022-09-16 Laminated parts and methods for manufacturing the same, laminates and methods for manufacturing the same Active JP7381806B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021157493 2021-09-28
JP2021157493 2021-09-28
PCT/JP2022/034810 WO2023054031A1 (en) 2021-09-28 2022-09-16 Laminate part and method for manufacturing same, and laminate and method for manufacturing same

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JPWO2023054031A1 JPWO2023054031A1 (en) 2023-04-06
JPWO2023054031A5 true JPWO2023054031A5 (en) 2023-09-06
JP7381806B2 JP7381806B2 (en) 2023-11-16

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3981090B2 (en) 2004-02-19 2007-09-26 株式会社東芝 Manufacturing method of electronic device
JP5749477B2 (en) * 2010-11-26 2015-07-15 電気化学工業株式会社 Heat dissipation board and electronic components
WO2015022956A1 (en) * 2013-08-14 2015-02-19 電気化学工業株式会社 Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
EP3763690B1 (en) 2018-03-07 2023-10-11 Denka Company Limited Temporarily bonded body composed of ceramic resin composite and metal plate; method for manufacturing the same, and transporting said temporarily bonded body
WO2022209325A1 (en) 2021-03-31 2022-10-06 デンカ株式会社 Composite, method for manufacturing same, resin-filled plate, laminate, and method for manufacturing same

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