JPWO2023042600A5 - - Google Patents

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Publication number
JPWO2023042600A5
JPWO2023042600A5 JP2023548371A JP2023548371A JPWO2023042600A5 JP WO2023042600 A5 JPWO2023042600 A5 JP WO2023042600A5 JP 2023548371 A JP2023548371 A JP 2023548371A JP 2023548371 A JP2023548371 A JP 2023548371A JP WO2023042600 A5 JPWO2023042600 A5 JP WO2023042600A5
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JP
Japan
Prior art keywords
resin composition
composition according
adhesive
electronic components
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023548371A
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English (en)
Japanese (ja)
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JPWO2023042600A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/031255 external-priority patent/WO2023042600A1/ja
Publication of JPWO2023042600A1 publication Critical patent/JPWO2023042600A1/ja
Publication of JPWO2023042600A5 publication Critical patent/JPWO2023042600A5/ja
Pending legal-status Critical Current

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JP2023548371A 2021-09-15 2022-08-18 Pending JPWO2023042600A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021149897 2021-09-15
PCT/JP2022/031255 WO2023042600A1 (ja) 2021-09-15 2022-08-18 樹脂組成物、電子部品用接着剤、及びそれらの硬化物、並びに電子部品

Publications (2)

Publication Number Publication Date
JPWO2023042600A1 JPWO2023042600A1 (https=) 2023-03-23
JPWO2023042600A5 true JPWO2023042600A5 (https=) 2024-12-25

Family

ID=85602126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548371A Pending JPWO2023042600A1 (https=) 2021-09-15 2022-08-18

Country Status (6)

Country Link
EP (1) EP4403596A4 (https=)
JP (1) JPWO2023042600A1 (https=)
KR (1) KR20240054979A (https=)
CN (1) CN117940488A (https=)
TW (1) TW202313839A (https=)
WO (1) WO2023042600A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202544138A (zh) * 2024-03-04 2025-11-16 日商納美仕有限公司 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311744B2 (ja) 2007-01-29 2013-10-09 地方独立行政法人 大阪市立工業研究所 紫外線硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
JP2010117545A (ja) 2008-11-13 2010-05-27 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその用途
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
JP6329030B2 (ja) * 2014-08-25 2018-05-23 ナミックス株式会社 接着剤
JP6699145B2 (ja) * 2015-11-30 2020-05-27 味の素株式会社 光および熱硬化性樹脂組成物
JP2019508549A (ja) * 2016-02-16 2019-03-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ結晶エポキシチオール(メタ)アクリレート複合材料およびナノ結晶エポキシチオール(メタクリレート)複合フィルム
JP6864436B2 (ja) 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
JP6810659B2 (ja) 2017-06-06 2021-01-06 日本化薬株式会社 電子部品用樹脂組成物
US20200347227A1 (en) * 2018-01-30 2020-11-05 Namics Corporation Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
CN111040644A (zh) * 2018-10-15 2020-04-21 烟台德邦科技有限公司 一种可光催化聚合的丙烯酸酯结构胶
JP7593042B2 (ja) * 2019-10-31 2024-12-03 味の素株式会社 硬化性組成物
JP7552221B2 (ja) * 2019-10-31 2024-09-18 味の素株式会社 硬化性組成物

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