JPWO2023042536A1 - - Google Patents
Info
- Publication number
- JPWO2023042536A1 JPWO2023042536A1 JP2023548145A JP2023548145A JPWO2023042536A1 JP WO2023042536 A1 JPWO2023042536 A1 JP WO2023042536A1 JP 2023548145 A JP2023548145 A JP 2023548145A JP 2023548145 A JP2023548145 A JP 2023548145A JP WO2023042536 A1 JPWO2023042536 A1 JP WO2023042536A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/435—Cross-sectional shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021150121 | 2021-09-15 | ||
| PCT/JP2022/027572 WO2023042536A1 (ja) | 2021-09-15 | 2022-07-13 | 炭化珪素半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042536A1 true JPWO2023042536A1 (https=) | 2023-03-23 |
| JPWO2023042536A5 JPWO2023042536A5 (https=) | 2024-06-05 |
Family
ID=85602724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548145A Pending JPWO2023042536A1 (https=) | 2021-09-15 | 2022-07-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240339499A1 (https=) |
| JP (1) | JPWO2023042536A1 (https=) |
| CN (1) | CN117693823A (https=) |
| DE (1) | DE112022004405T5 (https=) |
| WO (1) | WO2023042536A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5321377B2 (ja) * | 2009-09-11 | 2013-10-23 | 三菱電機株式会社 | 電力用半導体装置 |
| JP6282088B2 (ja) * | 2013-11-13 | 2018-02-21 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| DE112017007186B4 (de) * | 2017-03-07 | 2024-06-27 | Mitsubishi Electric Corporation | Halbleitereinheit und leistungswandler |
| US10269951B2 (en) * | 2017-05-16 | 2019-04-23 | General Electric Company | Semiconductor device layout and method for forming same |
| JP6876767B2 (ja) * | 2019-10-07 | 2021-05-26 | ローム株式会社 | 半導体装置 |
| JP7276691B2 (ja) | 2020-03-18 | 2023-05-18 | トヨタ自動車株式会社 | セパレータ一体型電極の製造方法 |
| JP2020175278A (ja) | 2020-08-07 | 2020-10-29 | 株式会社三洋物産 | 遊技機 |
-
2022
- 2022-07-13 CN CN202280051428.1A patent/CN117693823A/zh active Pending
- 2022-07-13 DE DE112022004405.5T patent/DE112022004405T5/de active Pending
- 2022-07-13 JP JP2023548145A patent/JPWO2023042536A1/ja active Pending
- 2022-07-13 US US18/580,785 patent/US20240339499A1/en active Pending
- 2022-07-13 WO PCT/JP2022/027572 patent/WO2023042536A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023042536A1 (ja) | 2023-03-23 |
| CN117693823A (zh) | 2024-03-12 |
| DE112022004405T5 (de) | 2024-07-04 |
| US20240339499A1 (en) | 2024-10-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240124 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250623 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20260407 |