JPWO2023042536A1 - - Google Patents

Info

Publication number
JPWO2023042536A1
JPWO2023042536A1 JP2023548145A JP2023548145A JPWO2023042536A1 JP WO2023042536 A1 JPWO2023042536 A1 JP WO2023042536A1 JP 2023548145 A JP2023548145 A JP 2023548145A JP 2023548145 A JP2023548145 A JP 2023548145A JP WO2023042536 A1 JPWO2023042536 A1 JP WO2023042536A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023548145A
Other languages
Japanese (ja)
Other versions
JPWO2023042536A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023042536A1 publication Critical patent/JPWO2023042536A1/ja
Publication of JPWO2023042536A5 publication Critical patent/JPWO2023042536A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/81Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435Cross-sectional shapes or dispositions of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
JP2023548145A 2021-09-15 2022-07-13 Pending JPWO2023042536A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021150121 2021-09-15
PCT/JP2022/027572 WO2023042536A1 (ja) 2021-09-15 2022-07-13 炭化珪素半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023042536A1 true JPWO2023042536A1 (https=) 2023-03-23
JPWO2023042536A5 JPWO2023042536A5 (https=) 2024-06-05

Family

ID=85602724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548145A Pending JPWO2023042536A1 (https=) 2021-09-15 2022-07-13

Country Status (5)

Country Link
US (1) US20240339499A1 (https=)
JP (1) JPWO2023042536A1 (https=)
CN (1) CN117693823A (https=)
DE (1) DE112022004405T5 (https=)
WO (1) WO2023042536A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5321377B2 (ja) * 2009-09-11 2013-10-23 三菱電機株式会社 電力用半導体装置
JP6282088B2 (ja) * 2013-11-13 2018-02-21 三菱電機株式会社 半導体装置及びその製造方法
DE112017007186B4 (de) * 2017-03-07 2024-06-27 Mitsubishi Electric Corporation Halbleitereinheit und leistungswandler
US10269951B2 (en) * 2017-05-16 2019-04-23 General Electric Company Semiconductor device layout and method for forming same
JP6876767B2 (ja) * 2019-10-07 2021-05-26 ローム株式会社 半導体装置
JP7276691B2 (ja) 2020-03-18 2023-05-18 トヨタ自動車株式会社 セパレータ一体型電極の製造方法
JP2020175278A (ja) 2020-08-07 2020-10-29 株式会社三洋物産 遊技機

Also Published As

Publication number Publication date
WO2023042536A1 (ja) 2023-03-23
CN117693823A (zh) 2024-03-12
DE112022004405T5 (de) 2024-07-04
US20240339499A1 (en) 2024-10-10

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