JPWO2023033090A1 - - Google Patents
Info
- Publication number
- JPWO2023033090A1 JPWO2023033090A1 JP2023545666A JP2023545666A JPWO2023033090A1 JP WO2023033090 A1 JPWO2023033090 A1 JP WO2023033090A1 JP 2023545666 A JP2023545666 A JP 2023545666A JP 2023545666 A JP2023545666 A JP 2023545666A JP WO2023033090 A1 JPWO2023033090 A1 JP WO2023033090A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021141967 | 2021-08-31 | ||
PCT/JP2022/032886 WO2023033090A1 (ja) | 2021-08-31 | 2022-08-31 | 半導体素子パッケージの製造方法及び半導体素子パッケージ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023033090A1 true JPWO2023033090A1 (zh) | 2023-03-09 |
Family
ID=85412276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023545666A Pending JPWO2023033090A1 (zh) | 2021-08-31 | 2022-08-31 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2023033090A1 (zh) |
KR (1) | KR20240052777A (zh) |
CN (1) | CN117897806A (zh) |
TW (1) | TW202312295A (zh) |
WO (1) | WO2023033090A1 (zh) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3669782B2 (ja) * | 1996-08-14 | 2005-07-13 | ジャパンゴアテックス株式会社 | Icパッケージ接着用シート及びicパッケージ |
JP3801601B2 (ja) * | 2004-06-15 | 2006-07-26 | シャープ株式会社 | 蓋部を備えた半導体ウェハの製造方法及び半導体装置の製造方法 |
JP2006344903A (ja) * | 2005-06-10 | 2006-12-21 | Fujifilm Holdings Corp | 半導体モジュール |
JP2007157792A (ja) * | 2005-11-30 | 2007-06-21 | Matsushita Electric Works Ltd | ウェハースケール半導体パッケージの製造方法 |
JP4091969B1 (ja) * | 2007-07-12 | 2008-05-28 | 住友ベークライト株式会社 | 受光装置および受光装置の製造方法 |
JP2009043893A (ja) | 2007-08-08 | 2009-02-26 | Fujikura Ltd | 半導体パッケージ及びその製造方法 |
JP5605258B2 (ja) * | 2011-02-16 | 2014-10-15 | オムロン株式会社 | ウエハレベルパッケージ、チップサイズパッケージデバイス及びウエハレベルパッケージの製造方法 |
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2022
- 2022-08-31 JP JP2023545666A patent/JPWO2023033090A1/ja active Pending
- 2022-08-31 KR KR1020247008607A patent/KR20240052777A/ko unknown
- 2022-08-31 CN CN202280058779.5A patent/CN117897806A/zh active Pending
- 2022-08-31 TW TW111133027A patent/TW202312295A/zh unknown
- 2022-08-31 WO PCT/JP2022/032886 patent/WO2023033090A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN117897806A (zh) | 2024-04-16 |
TW202312295A (zh) | 2023-03-16 |
WO2023033090A1 (ja) | 2023-03-09 |
KR20240052777A (ko) | 2024-04-23 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20240306 |