JPWO2023032923A1 - - Google Patents

Info

Publication number
JPWO2023032923A1
JPWO2023032923A1 JP2023545564A JP2023545564A JPWO2023032923A1 JP WO2023032923 A1 JPWO2023032923 A1 JP WO2023032923A1 JP 2023545564 A JP2023545564 A JP 2023545564A JP 2023545564 A JP2023545564 A JP 2023545564A JP WO2023032923 A1 JPWO2023032923 A1 JP WO2023032923A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545564A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032923A1 publication Critical patent/JPWO2023032923A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
JP2023545564A 2021-09-06 2022-08-29 Pending JPWO2023032923A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021144611 2021-09-06
PCT/JP2022/032438 WO2023032923A1 (ja) 2021-09-06 2022-08-29 半導体用の膜を形成するための組成物、積層体及び基板積層体

Publications (1)

Publication Number Publication Date
JPWO2023032923A1 true JPWO2023032923A1 (ja) 2023-03-09

Family

ID=85412775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545564A Pending JPWO2023032923A1 (ja) 2021-09-06 2022-08-29

Country Status (5)

Country Link
JP (1) JPWO2023032923A1 (ja)
KR (1) KR20240050367A (ja)
CN (1) CN117941037A (ja)
TW (1) TW202323491A (ja)
WO (1) WO2023032923A1 (ja)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933120B1 (ja) 1968-06-21 1974-09-04
JPH04132258A (ja) 1990-09-25 1992-05-06 Nec Corp 半導体基板の接続体およびその接続方法
EP0534304A1 (de) 1991-09-21 1993-03-31 Hoechst Aktiengesellschaft Cycloalkylierte Polyethyleniminderivate und ihre Verwendung als Hypolipidämika
JPH0940931A (ja) * 1995-08-02 1997-02-10 Hitachi Chem Co Ltd 耐熱性接着剤及び半導体装置
JP5201048B2 (ja) 2009-03-25 2013-06-05 富士通株式会社 半導体装置とその製造方法
EP2357664A4 (en) 2009-05-29 2014-07-30 Mitsui Chemicals Inc SEMICONDUCTOR SEALING COMPOSITION, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
JP2012123958A (ja) 2010-12-07 2012-06-28 Panasonic Corp 導光板及び照明装置
JP2012216836A (ja) * 2011-03-31 2012-11-08 Mitsubishi Chemicals Corp 三次元集積回路積層体
JP2016047895A (ja) 2014-08-28 2016-04-07 株式会社ダイセル 半導体用接着剤組成物
WO2017086360A1 (ja) * 2015-11-16 2017-05-26 三井化学株式会社 半導体用膜組成物、半導体用膜組成物の製造方法、半導体用部材の製造方法、半導体用工程材の製造方法及び半導体装置
JP7351637B2 (ja) * 2018-05-29 2023-09-27 旭化成株式会社 樹脂組成物、及び硬化膜の製造方法
WO2020085183A1 (ja) * 2018-10-26 2020-04-30 三井化学株式会社 基板積層体の製造方法及び積層体
JP2020095111A (ja) * 2018-12-11 2020-06-18 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた半導体用配線層及び半導体基板
JP2021144611A (ja) 2020-03-13 2021-09-24 アパテックジャパン株式会社 衣服サイズ推薦システム

Also Published As

Publication number Publication date
CN117941037A (zh) 2024-04-26
WO2023032923A1 (ja) 2023-03-09
KR20240050367A (ko) 2024-04-18
TW202323491A (zh) 2023-06-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240105