JPWO2023032924A1 - - Google Patents

Info

Publication number
JPWO2023032924A1
JPWO2023032924A1 JP2023545565A JP2023545565A JPWO2023032924A1 JP WO2023032924 A1 JPWO2023032924 A1 JP WO2023032924A1 JP 2023545565 A JP2023545565 A JP 2023545565A JP 2023545565 A JP2023545565 A JP 2023545565A JP WO2023032924 A1 JPWO2023032924 A1 JP WO2023032924A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545565A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032924A1 publication Critical patent/JPWO2023032924A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
JP2023545565A 2021-09-06 2022-08-29 Pending JPWO2023032924A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021144612 2021-09-06
PCT/JP2022/032439 WO2023032924A1 (ja) 2021-09-06 2022-08-29 半導体用の膜を形成するための組成物、積層体及び基板積層体

Publications (1)

Publication Number Publication Date
JPWO2023032924A1 true JPWO2023032924A1 (ja) 2023-03-09

Family

ID=85412274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545565A Pending JPWO2023032924A1 (ja) 2021-09-06 2022-08-29

Country Status (5)

Country Link
JP (1) JPWO2023032924A1 (ja)
KR (1) KR20240050368A (ja)
CN (1) CN117897799A (ja)
TW (1) TW202317732A (ja)
WO (1) WO2023032924A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0940931A (ja) * 1995-08-02 1997-02-10 Hitachi Chem Co Ltd 耐熱性接着剤及び半導体装置
JP4699565B2 (ja) 2009-05-29 2011-06-15 三井化学株式会社 半導体用シール組成物、半導体装置および半導体装置の製造方法
JP2012216836A (ja) * 2011-03-31 2012-11-08 Mitsubishi Chemicals Corp 三次元集積回路積層体
WO2017086361A1 (ja) * 2015-11-16 2017-05-26 三井化学株式会社 半導体用膜組成物、半導体用膜組成物の製造方法、半導体用部材の製造方法、半導体用工程材の製造方法及び半導体装置
JP7351637B2 (ja) * 2018-05-29 2023-09-27 旭化成株式会社 樹脂組成物、及び硬化膜の製造方法
JP7162679B2 (ja) * 2018-10-26 2022-10-28 三井化学株式会社 基板積層体の製造方法及び積層体
JP2020095111A (ja) * 2018-12-11 2020-06-18 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた半導体用配線層及び半導体基板
JP2021144612A (ja) 2020-03-13 2021-09-24 アパテックジャパン株式会社 ジェスチャーアクション識別に基づく衣類販売棚の展示システム

Also Published As

Publication number Publication date
KR20240050368A (ko) 2024-04-18
WO2023032924A1 (ja) 2023-03-09
CN117897799A (zh) 2024-04-16
TW202317732A (zh) 2023-05-01

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112021014123A2 (ja)
BR112023012656A2 (ja)
BR112022024743A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
JPWO2023032924A1 (ja)
JPWO2023032923A1 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011539A2 (ja)
BR112023011610A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240105